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Laser sealing of organic light-emitting diode using low melting temperature glass frit

机译：使用低熔点玻璃粉激光密封有机发光二极管

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摘要

Glass frit encapsulation for laser-base sealing of the complex interiors results challenges for the electronics manufacturing process. The conventional frit packaging method relies on elevating thermal process by furnace where the package is heated to required temperature, hence limiting the use of temperature-sensitive materials and also creating problems in different packaging processes or multi-stage sealing products. In this paper, the benefits of combining novel laser-assist hermetical sealing and low temperature glass frit packaging are demonstrated and the technique offers a suitable and feasible solution. This frit of absorbent at specific laser wavelength is selected and applied as excellent contact with both large CTE range substrates. Glass frit composites consisting of a PbTiO_3 ceramic and the rare earth Nd_2O_3 are evaluated for thermal properties and electrical characteristics. This developed glass frit hermetical sealing method achieves moisture durability, satisfying the enculturation of electronics-level. In this paper, we demonstrate successfully using laser to seal organic light emitting diode (OLED) via low melting temperature glass frit.
机译：用于复杂基础结构的激光基密封的玻璃粉封装对电子制造过程提出了挑战。传统的玻璃料包装方法依赖于通过加热炉将包装加热至所需温度的热过程，从而限制了对温度敏感的材料的使用，并且在不同的包装过程或多级密封产品中也产生了问题。在本文中，展示了将新型激光辅助气密密封与低温玻璃粉包装相结合的好处，并且该技术提供了合适且可行的解决方案。选择该吸收剂在特定激光波长下的熔块，并与两个大CTE范围的基材进行出色的接触。对由PbTiO_3陶瓷和稀土Nd_2O_3组成的玻璃料复合材料的热性能和电特性进行了评估。这种发达的玻璃粉气密密封方法实现了耐湿性，满足了电子级的培养要求。在本文中，我们成功演示了使用激光通过低熔点玻璃料密封有机发光二极管（OLED）的方法。

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  • 来源
    《Optical and quantum electronics》 |2017年第6期|208.1-208.10|共10页
  • 作者

    Lin Chihyun; Shen Yunhwei; Huang Chunchieh; Tu Shenglung;

  • 作者单位

    Department of Resources Engineering, National Cheng Kung University, Tainan, Taiwan;

    Department of Resources Engineering, National Cheng Kung University, Tainan, Taiwan;

    Department of Electrical Engineering, Cheng Shiu University, Kaohsiung, Taiwan;

    Department of Resources Engineering, National Cheng Kung University, Tainan, Taiwan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Glass frit; Laser application; OLED; Sealing;

    机译：玻璃料;激光应用;你是;封口;

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