机译:DI和CTIA读出集成电路输入特性的理论研究
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China,University of Chinese Academy of Sciences, Beijing 100039, China,Henan University of Science and Technology, Luoyang 471023, China;
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China;
IRFPA; DI; CTIA; Injection efficiency;
机译:在光子计数成像读出电路的行为水平上进行功率分布和基板噪声耦合研究
机译:具有面积分布的输入输出焊盘的集成电路的自动化设计
机译:具有面积分布的输入输出焊盘的集成电路的自动化设计
机译:DI和CTIA读出集成电路的注入效率
机译:研究材料,技术以及集成电路的静电放电(ESD)保护测试。
机译:单和二氯取代基对八氟环丁烷的隔热和温室效应的理论研究
机译:基于异构显示的多传感器系统的可重构读出集成电路
机译:毫米波集成电路微带不连续性的理论与实验研究