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Concept of a polishing tool based on viscoelastic properties for midspatial frequencies suppression on aspheric surfaces

机译：基于粘弹性的抛光工具的概念，用于抑制非球面表面的中空频率

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摘要

We focus on the subaperture polishing tool concept development for suppressing midspatial frequencies (MSF) arising from computer numerical control machining of aspherical optical surfaces. The selective effect in the MSF range is achieved by setting the tool viscoelastic properties so that rigidity increases in the frequency-domain generated by the rotational tool movement over the aspheric surface with the MSF while the tool remains flexible in the lower frequency range associated with tool radial direction movement. The mechanism of MSF removal is discussed in detail, including in terms of elasticity module frequency dependences, and is also experimentally verified. In order to monitor and optimize viscoelastic properties, especially in regard to frequency dependences, the dynamic mechanical analysis method has been developed and applied and is presented in the paper as well.
机译：我们专注于抑制非球面光学表面的计算机数控加工引起的中空频率（MSF）的亚孔径抛光工具概念的开发。 MSF范围内的选择性效果是通过设置工具的粘弹性属性来实现的，这样，在MSF的作用下，工具在非球面表面上在非球面上旋转所产生的频域中的刚度增加，而工具在与工具相关的较低频率范围内仍保持柔韧性径向运动。详细讨论了MSF去除的机制，包括弹性模块频率依赖性，并进行了实验验证。为了监测和优化粘弹性，特别是在频率依赖性方面，已经开发并应用了动态力学分析方法，并在本文中进行了介绍。

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