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首页> 外文期刊>Optical engineering >Fully passive-alignment pluggable compact parallel optical interconnection modules based on a direct-butt-coupling structure for fiber-optic applications
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Fully passive-alignment pluggable compact parallel optical interconnection modules based on a direct-butt-coupling structure for fiber-optic applications

机译：基于直接对接耦合结构的完全无源对准可插拔紧凑型并行光学互连模块，用于光纤应用

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摘要

A low-cost packaging method utilizing a fully passive optical alignment and surface-mounting method is demonstrated for pluggable compact and slim multichannel optical interconnection modules using a VCSEL/ PIN-PD chip array. The modules are based on a nonplanar bent right-angle electrical signal path on a silicon platform and direct-butt-optical coupling without a bulky and expensive microlens array. The measured optical direct-butt-coupling efficiencies of each channel without any bulky optics are as high as 33% and 95% for the transmitter and receiver, respectively. Excellent lateral optical alignment tolerance of larger than 60 μm for both the transmitter and receiver module significantly reduces the manufacturing and material costs as well as the packaging time. The clear eye diagrams, extinction ratios higher than 8 dB at 10.3 Gbps for the transmitter module, and receiver sensitivity of better than -13.1 dBm at 10.3 Gbps and a bit error rate of 10~(-12) for all channels are demonstrated. Considering that the optical output power of the transmitter is greater than 0 dBm, the module has a sufficient power margin of about 13 dB for 10.3 Gbps operations for all channels.
机译：对于使用VCSEL / PIN-PD芯片阵列的可插拔紧凑且纤薄的多通道光学互连模块，演示了一种利用完全无源光学对准和表面安装方法的低成本封装方法。这些模块基于硅平台上的非平面弯曲直角电信号路径和直接对接光耦合，而没有笨重且昂贵的微透镜阵列。在没有任何笨重的光学器件的情况下，每个通道测得的光直接对接耦合效率分别高达发射机和接收机的33％和95％。发射器和接收器模块均具有超过60μm的出色横向光学对准公差，大大降低了制造和材料成本以及封装时间。清晰的眼图，10.3 Gbps的发射器模块的消光比高于8 dB，10.3 Gbps的接收器灵敏度高于-13.1 dBm以及所有通道的误码率均为10〜（-12）。考虑到发射器的光输出功率大于0 dBm，对于所有通道的10.3 Gbps操作，模块均具有约13 dB的足够功率裕度。

著录项

  • 来源
    《Optical engineering》 |2016年第2期|026107.1-026107.9|共9页
  • 作者

    Kwon-Seob Lim; Hyoung-Jun Park; Hyun Seo Kang; Young Sun Kim; Jae-Hyung Jang;

  • 作者单位

    Electronics and Telecommunications Research Institute, Communications and Internet Research Laboratory, 11, Cheomdangwagi-ro 176beon-gil, Buk-gu, Gwangju 61012, South Korea,Gwangju Institute of Science and Technology, School of Information and Communications, 123 Cheomdangwagi-ro, Buk-gu, Gwangju 61005, South Korea;

    Electronics and Telecommunications Research Institute, Communications and Internet Research Laboratory, 11, Cheomdangwagi-ro 176beon-gil, Buk-gu, Gwangju 61012, South Korea;

    Electronics and Telecommunications Research Institute, Communications and Internet Research Laboratory, 11, Cheomdangwagi-ro 176beon-gil, Buk-gu, Gwangju 61012, South Korea;

    Electronics and Telecommunications Research Institute, Communications and Internet Research Laboratory, 11, Cheomdangwagi-ro 176beon-gil, Buk-gu, Gwangju 61012, South Korea;

    Gwangju Institute of Science and Technology, School of Information and Communications, 123 Cheomdangwagi-ro, Buk-gu, Gwangju 61005, South Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    fiber optic application; optical communications; optical interconnects; optoelectronic packaging; optoelectronics;

    机译：光纤应用;光通信;光学互连;光电包装;光电子学;

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