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首页> 外文期刊>Optical engineering >Simultaneous analysis of edge quality parameters for submillimeter-thick silicon wafer bar with Fourier optics
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Simultaneous analysis of edge quality parameters for submillimeter-thick silicon wafer bar with Fourier optics

机译：亚毫米厚的硅晶圆棒的边缘质量参数的傅立叶光学分析同时进行

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摘要

This paper proposes an edge quality assessment system for a submillimeter thick wafer bar suitable for semiconductor and hard disk drive industries. Our key approach is based on Fourier optics analysis in a retro-reflective optical architecture featuring nondestructive and noncon-tact measurement. In our proposed design, a collimated optical beam is incident on a submillimeter thick wafer bar from its side. In this way, part of the optical beam is reflected back and is then Fourier transformed on a two-dimensional image sensor. By investigating the far-field diffraction pattern, important parameters of the wafer bar such as thickness, surface parallelism, edge parallelism, and surface defect can simultaneously be analyzed. To our knowledge, this is the first time that these important parameters are analyzed by only one system. Other key features include low cost and vibration insensitivity. Our field test study using a 635-nm wavelength laser and a 15-cm plano-convex lens for specified 246-μm thick rectangular wafer bars shows that our retro-reflective approach can measure the bar thickness within its specified ± 10 /urn. It can also simultaneously evaluate the remaining desired parameters and can distinguish nicely edged bars from poorly edged bars. Other key features include low cost, ease of implementation, robustness, and low component counts.
机译：本文提出了一种适用于半导体和硬盘驱动器行业的亚毫米厚晶片棒的边缘质量评估系统。我们的关键方法是基于具有无损和非接触式测量功能的逆反射光学架构中的傅立叶光学分析。在我们提出的设计中，准直光束从侧面入射到亚毫米厚的晶片棒上。这样，光束的一部分被反射回去，然后在二维图像传感器上进行傅立叶变换。通过研究远场衍射图，可以同时分析晶片棒的重要参数，例如厚度，表面平行度，边缘平行度和表面缺陷。据我们所知，这是第一次仅由一个系统分析这些重要参数。其他关键特性包括低成本和对振动不敏感。我们使用635 nm波长的激光和15 cm平凸透镜对指定的246μm厚度的矩形圆片进行了现场测试研究，结果表明，我们的逆反射方法可以在指定的±10 / urn范围内测量圆片的厚度。它还可以同时评估剩余的所需参数，并可以将边缘较好的钢筋与边缘不良的钢筋区分开。其他关键功能包括低成本，易于实施，健壮性和较少的组件数量。

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  • 来源
    《Optical engineering》 |2011年第2期|p.78-84|共7页
  • 作者

    Sarun Sumriddetchkajorn; Kosom Chaitavon;

  • 作者单位

    Photonics Technology Laboratory Intelligent Devices and Systems Research Unit National Electronics and Computer Technology Center National Science and Technology Development Agency Ministry of Science and Technology 112 Thailand Science Park Phahonyothin Road, Klong 1, Klong Luang Pathumthani 12120, Thailand;

    Photonics Technology Laboratory Intelligent Devices and Systems Research Unit National Electronics and Computer Technology Center National Science and Technology Development Agency Ministry of Science and Technology 112 Thailand Science Park Phahonyothin Road, Klong 1, Klong Luang Pathumthani 12120, Thailand;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    form factor analysis; fourier optics; diffraction; hard disk drive sliders; nondestructive analysis.;

    机译：形状因子分析;傅立叶光学衍射;硬盘驱动器滑块;无损分析。;

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