...
首页> 外文期刊>Optical engineering >High-resolution 3-D imaging of objects through walls
【24h】

High-resolution 3-D imaging of objects through walls

机译:穿过墙壁的物体的高分辨率3D成像

获取原文
获取原文并翻译 | 示例
           

摘要

This paper describes the use of microwaves to accurately image objects behind dielectric walls. The data are first simulated by using a finite-difference time-domain code. A large model of a room with walls and objects inside is used as a test case. Since the model and associated volume are big compared to wavelengths, the code is run on a parallel supercomputer. A fixed 2-D receiver array captures all the return data simultaneously. A time-domain backprojection algorithm with a correction for the time delay and refraction caused by the front wall then reconstructs high-fidelity 3-D images. A rigorous refraction correction using Snell's law and a simpler but faster linear correction are compared in both 2-D and 3-D. It is shown that imaging in 3-D and viewing an image in the plane parallel to the receiver array is necessary to identify objects by shape. It is also shown that a simple linear correction for the wall is sufficient.
机译:本文介绍了如何使用微波对电介质墙后的物体进行精确成像。首先使用有限差分时域代码对数据进行仿真。一个带有墙壁和物体的房间的大型模型用作测试用例。由于与波长相比,模型和相关的体积很大,因此代码是在并行超级计算机上运行的。固定的二维接收器阵列可同时捕获所有返回数据。然后使用时域反投影算法对前壁造成的时间延迟和折射进行校正,然后重建高保真3D图像。在2-D和3-D中都比较了使用Snell定律的严格折射校正和更简单但更快的线性校正。结果表明,以3D形式成像并在平行于接收器阵列的平面中查看图像对于通过形状识别物体是必要的。还表明,对壁进行简单的线性校正就足够了。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号