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Ablation of Transparent Materials Using Excimer Lasers for Photonic Applications

机译：用于光子应用的准分子激光烧蚀透明材料

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摘要

For many years, the development of effective ablation or laser machining techniques for making micro-optical components has been the key factor in the birth of new photonic devices and systems. In this article, the ablation characteristics of two types of the most important transparent materials, transparent polymers and glasses, are studied. Simple shaped microcavities are first machined for studying the fundamental ablation parameters, including threshold fluence, effective absorption coefficient, and ablation rate. In studying polymer ablation, five standard grades and five proprietary polymeric compounds are selected. Ablation techniques using these transparent polymers for making arrayed ferrules and curved microlenses are presented. Applications of these ablated microstructures for optical fiber connectors, optical fiber coupling and alignment, and transparent chip encapsulants, are introduced and demonstrated with emphasis on the quality of the ablated profiles and dimensions to satisfy the required performance. In glass ablation, borosilicate glasses are considered and their associated ablation behaviors are studied. The procedures to ablate glass-based arrayed microstructures with flat and curved surfaces are described. The utilizations of these arrayed microstructures for optical waveguide, wave absorber, and beam guider, are specifically discussed. Finally, concluding remakes for future trends are presented.
机译：多年来，用于制造微光学组件的有效烧蚀或激光加工技术的发展一直是新光子器件和系统诞生的关键因素。在本文中，研究了两种最重要的透明材料（透明聚合物和玻璃）的烧蚀特性。首先加工简单形状的微腔，以研究基本的烧蚀参数，包括阈值通量，有效吸收系数和烧蚀率。在研究聚合物消融时，选择了五个标准等级和五个专有的聚合化合物。提出了使用这些透明聚合物制造阵列箍和弯曲微透镜的烧蚀技术。介绍并演示了这些烧蚀的微结构在光纤连接器，光纤耦合和对准以及透明芯片密封剂中的应用，并重点介绍了烧蚀轮廓的质量和尺寸，以满足所需的性能。在玻璃烧蚀中，考虑了硼硅酸盐玻璃并研究了其相关的烧蚀行为。描述了烧蚀具有平坦和弯曲表面的基于玻璃的阵列微结构的程序。专门讨论了这些排列的微结构在光波导，吸波器和光束导向器中的应用。最后，介绍了未来趋势的总结。

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