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首页> 外文期刊>Optics and Lasers in Engineering >Laser cutting of rectangular geometry into alumina tiles
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Laser cutting of rectangular geometry into alumina tiles

机译：将矩形几何体激光切割成氧化铝砖

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摘要

Laser cutting of rectangular geometry into the 5 mm thick alumina tiles is carried out. Temperature and stress fields, which are developed during the cutting process, are simulated in line with the experimental conditions. The morphological changes in the cutting sections are examined using optical and electron scanning microscopes, energy dispersive spectroscopy, and X-ray diffraction technique. The predictions of surface temperature and the residual stress are validated through the experimental data. It is found that von Mises stress attains high values in the region of the mid-thickness of the workpiece. The laser cut sections are free from major cracks and large scale sideways burning. The predictions of surface temperature and residual stress agree well with their counterparts obtained from the experiment.
机译：将矩形几何形状激光切割成5毫米厚的氧化铝砖。根据实验条件模拟了在切割过程中产生的温度和应力场。使用光学和电子扫描显微镜，能量分散光谱和X射线衍射技术检查切割部分的形态变化。通过实验数据验证了表面温度和残余应力的预测。发现冯·米塞斯应力在工件的中间厚度区域内达到较高的值。激光切割部分没有大的裂纹，也没有大规模的侧面燃烧。表面温度和残余应力的预测与从实验中获得的结果非常吻合。

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