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首页> 外文期刊>Optics and Lasers in Engineering >Underwater and water-assisted laser processing: Part 2―Etching, cutting and rarely used methods
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Underwater and water-assisted laser processing: Part 2―Etching, cutting and rarely used methods

机译：水下和水辅助激光加工：第2部分：蚀刻，切割和很少使用的方法

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摘要

In the second part of the article, the subtractive processes―laser etching and cutting in the presence of liquid water will be reviewed; but the rarely used methods of water assisted/ underwater laser processing, such as welding, silicon wafer breaking, surface modification of polymers, pulsed laser deposition, particle formation and water mask defined microstructures fabrication, will also be described. Etching and cutting under water provide better tolerances and smaller heat-affected zone widths and avoid the re-deposition of debris. Irradiation under water results in increased wetting of fluoropolymers, and laser ablation in water vapor provides deposition of highly crystalline hydroxyapatite coatings. Laser irradiation of solid targets in water has been used to fabricate Ag, Au, Ni, Cu and carbon nanoparticles. The results of an original study on the formation of free-standing high aspect ratio Pb(Zr_xTi_(1-x))O_3 microplates fabricated by laser irradiation of Pb(Zr_xTi_(1-x))O_3 ceramics in water are also reported. The platelets were up to 60 μm in diameter and 50-160 nm in thickness. The use of neutral liquids other than water and some medical applications of underwater/water-assisted laser light driven processes will also be briefly reviewed.
机译：在文章的第二部分中，将讨论减法过程-在液态水存在下的激光蚀刻和切割；但是也将描述水辅助/水下激光加工的很少使用的方法，例如焊接，硅片破碎，聚合物的表面改性，脉冲激光沉积，颗粒形成和水掩模定义的微结构制造。在水下蚀刻和切割可提供更好的公差和较小的受热影响区域宽度，并避免重新沉积碎屑。在水下照射会导致含氟聚合物的润湿性增加，并且在水蒸气中进行激光烧蚀会沉积出高度结晶的羟基磷灰石涂层。水中的固体靶标的激光辐照已用于制造Ag，Au，Ni，Cu和碳纳米颗粒。还报道了通过在水中激光辐照Pb（Zr_xTi_（1-x））O_3陶瓷而形成的高纵横比独立式Pb（Zr_xTi_（1-x））O_3微孔板的原始研究结果。血小板直径最大为60μm，厚度最大为50-160 nm。除水以外的中性液体的使用以及水下/水辅助激光驱动过程的某些医疗应用也将简要回顾。

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