Diamond Packaging

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Diamond Packaging

机译：钻石包装

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Diamond designs and manufactures innovative and sustainable paper-board and plastic folding cartons, counter-top displays, sample packaging, blister cards, and dispenser cartons. Its folding carton plant capabilities include structural design, full inter-station UV sheetfed offsetrnprinting, UV and specialty coatings, MiraFoil? coating, Cast and Cure holographic effects, foil stamping, embossing, diecutting, taping, windowing, gluing, inserting, and source tagging. Diamond Contract Manufacturing (DCM) offers contract manufacturing and packaging services.

机译：Diamond设计和制造创新且可持续的纸板和塑料折叠纸盒，台面展示架，样品包装，泡罩卡和分配器纸盒。它的折叠纸箱生产能力包括结构设计，全站间UV单张纸胶印，UV和特种涂料，MiraFoil？涂层，浇铸和固化全息效果，箔印，压纹，模切，包带，开窗，粘合，插入和源标记。钻石合同制造（DCM）提供合同制造和包装服务。

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《Package printing》 |2010年第9期|P.22|共1页
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收录信息美国《工程索引》(EI);
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正文语种 eng
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专利

1. The processing technology and electronic packaging of CVD diamond: a case study for GaAs/CVD Diamond plasti packages [J] . Philip M.Fabis Microelectronics & Reliability . 2002,第2期

机译：CVD金刚石的加工技术和电子包装：以GaAs / CVD金刚石塑料包装为例
2. Diamond Packaging Continues its Efforts Toward Becoming Carbon Neutral [J] . Package printing and converting . 2021,第5期

机译：金刚石包装继续努力成为碳中性
3. Improvement of durability and sliding properties of food packaging equipment by combined treatment of Diamond-like carbon coating and Fine particle bombarding [J] . Mikamoto Kotono, Nishitani Tomoko, Tsubaki Yuta, Journal of Applied Packaging Research . 2020,第1期

机译：通过组合治疗金刚石碳涂层和细粒子轰击的耐用性和食品包装设备的耐久性和滑动性能
4. All diamond packaging for wireless integrated micro-systems using ultra-fast diamond growth [C] . XiangWei Zhu, Steve Guillaudeu, Dean M. Aslam, IEEE Annual International Conference on Micro Electro Mechanical Systems . 2003

机译：所有钻石封装，无线集成微型系统使用超快速钻石生长
5. Diamond-based heat spreaders for power electronic packaging applications. [D] . Guillemet, Thomas. 2013

机译：基于金刚石的散热器，用于电力电子包装应用。
6. Diamond Boron Nitride: Pressure‐Induced Formation and Mechanical Properties of 2D Diamond Boron Nitride (Adv. Sci. 2/2021) [O] . Filippo Cellini, Francesco Lavini, Elton Chen, 2021

机译：金刚石硼氮化物：压力诱导的2D金刚石氮化物的形成和力学性能（ADV。SCI。2/2021）
7. Analysis of High-Power LED Packages with Diamond and CNT Film [O] . Cheng Yi Hsu, Yuli Lin 2017

机译：用钻石和CNT薄膜分析大功率LED封装

Diamond Packaging

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