Interfacial thermal conductance across metal-insulator/semiconductor interfaces due to surface states

著录项

• 来源
  《Physical review》 |2016年第8期|085433.1-085433.7|共7页
• 作者

  Tingyu Lu; Jun Zhou; Tsuneyoshi Nakayama; Ronggui Yang; Baowen Li;

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• 作者单位

  Center for Phononics and Thermal Energy Science, School of Physics Science and Engineering, Tongji University, Shanghai 200092, People's Republic of China;

  Center for Phononics and Thermal Energy Science, School of Physics Science and Engineering, Tongji University, Shanghai 200092, People's Republic of China;

  Center for Phononics and Thermal Energy Science, School of Physics Science and Engineering, Tongji University, Shanghai 200092, People's Republic of China,Hokkaido University, Sapporo 060-0826, Japan;

  Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA,Materials Science and Engineering Program, University of Colorado, Boulder, Colorado 80309, USA;

  Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA;

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• 正文语种 eng
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