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Annealing Behavior of Palladium-Nickel Alloy Electrodeposits

机译:钯镍合金电沉积的退火行为

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The annealing behavior of palladium-nickel alloy deposits in the range of 85-15 to 70-30 percent Pd-Ni can be utilized to produce a ductile electrodeposit amenable to stamping and forming of electronic contacts. Differential scanning calorimetry, scanning electron microscopy, and transmission electron microscopy have been employed to explain the annealing behavior and reconcile the anomalous observations with the classical binary phase diagram information. The annealed deposit has the desired physical properties characteristic of the Pd-Ni alloy, especially hardness, ductility, and corrosion resistance. Practical application of the annealing process has been demonstrated in the electroplating, annealing and stamping and forming of stripe-on-strip 725 alloy and 910P materials to make electronic contacts and connectors.
机译:钯-镍合金沉积物在85-15%至70-30%的Pd-Ni范围内的退火行为可用于生产适于冲压和形成电子触点的韧性电沉积物。差示扫描量热法,扫描电子显微镜和透射电子显微镜已被用来解释退火行为并用经典的二元相图信息来调节异常观测值。退火的沉积物具有Pd-Ni合金所需的物理特性,特别是硬度,延展性和耐腐蚀性。退火工艺的实际应用已在带状带状725合金和910P材料的电镀,退火和冲压以及成形过程中得到证明,以制造电子触点和连接器。

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