Direct Metallization on Surface-Modified Polyimide Resin

M. Seita; M. Kusaka; H. Nawafune; S. Mizumoto

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Direct Metallization on Surface-Modified Polyimide Resin

机译：在表面改性的聚酰亚胺树脂上直接金属化

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A new method was investigated for formation of a thin copper film on a polyimide resin, through sulfonation of the resin surface, followed by adsorption and reduction of copper ions. Polyimide is a generic name for a group of thermally stable resins that contain imide rings. This resin can be represented by a reaction product of oxydianiline and pyromellitic anhydride. Because of its excellent thermal stability, mechanical strength, electrical characteristics, and low flammability,' polyimide resin is widely used in electronic miniaturization, and multilayer circuit board applications. Polyimide resin becomes indispensable for flexible printed circuits (FPC), tab automated bonding (TAB) film carriers, and dielectric for multilayer applications.

机译：研究了一种通过在树脂表面进行磺化，然后吸附和还原铜离子，在聚酰亚胺树脂上形成薄铜膜的新方法。聚酰亚胺是一组含有酰亚胺环的热稳定树脂的通用名称。该树脂可以以二苯胺与均苯四酸酐的反应产物为代表。由于其出色的热稳定性，机械强度，电特性和低易燃性，聚酰亚胺树脂广泛用于电子小型化和多层电路板应用中。聚酰亚胺树脂对于柔性印刷电路（FPC），标签自动粘合（TAB）薄膜载体以及多层应用的电介质来说是必不可少的。

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《Plating & Surface Finishing》 |1996年第12期|p.57-59|共3页
作者
M. Seita; M. Kusaka; H. Nawafune; S. Mizumoto;
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正文语种 eng
中图分类金属腐蚀与保护、金属表面处理;
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1. Site-selective direct silver metallization on surface-modified polyimide layers [J] . Akamatsu K., Ikeda S., Nawafune H. Langmuir: The ACS Journal of Surfaces and Colloids . 2003,第24期

机译：在表面改性的聚酰亚胺层上进行定点选择性直接银金属化
2. Photochemical formation of palladium patterns on surface-modified polyimide resin [J] . Seita M., Nawafune H., Nishioka T., Journal of Applied Electrochemistry . 2002,第3期

机译：表面改性聚酰亚胺树脂上钯图形的光化学形成
3. Photochemical formation of palladium patterns on surface-modified polyimide resin [J] . M. Seita, H. Nawafune, T. Nishioka, Journal of Applied Electrochemistry . 2002,第3期

机译：表面改性聚酰亚胺树脂上钯图形的光化学形成
4. FACILE SYNTHESIS OF SULFONATED POLYIMIDE WITH HIGHLY CONDUCTIVE SILVER ELECTRODE VIA DIRECT IONEXCHANGE SELF-METALLIZATION FOR ELECTRO-ACTIVE ARTIFICIAL MUSCLE [C] . J. Song, J. H. Jeon, I. K. Oh International Conference on Composite Materials . 2011

机译：通过直接离子化自金属化对电活性人工肌肉的磺化聚酰亚胺与高导电银电极的构成
5. Non destructive FTIR-photoacoustic spectroscopy studies on carbon fiber reinforced polyimide composite and water diffusion in epoxy resin. [D] . Vijayaraghavan, Ravikumar. 2008

机译：碳纤维增强聚酰亚胺复合材料和环氧树脂中水扩散的无损FTIR光声光谱研究。
6. Friction and Wear Behavior of Polyimide Composites Reinforced by Surface-Modified Poly-p-Phenylenebenzobisoxazole (PBO) Fibers in High Ambient Temperatures [O] . Liang Yu, Yuanjie Zhang, Jiaming Tang, 2019

机译：表面改性的聚对苯撑苯并双恶唑（PBO）纤维增强的聚酰亚胺复合材料在高温下的摩擦磨损性能
7. Direct Metallization of Polyimide Resin Using Ion-doped Precursor Approach [O] . Kensuke AKAMATSU, Yohei TAKASHIMA, Takaaki TSURUOKA 2019

机译：使用离子掺杂前体方法直接金属化聚酰亚胺树脂
8. Correlations of norbornenyl crosslinked polyimide resin structures with resin thermo-oxidative stability, resin glass transition temperature and composite initial mechanical properties [R] . Alston, William B. 1988

机译：降冰片烯交联聚酰亚胺树脂结构与树脂热氧稳定性，树脂玻璃化转变温度和复合材料初始力学性能的相关性

Direct Metallization on Surface-Modified Polyimide Resin

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