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Thermal, mechanical and electrical properties of copper powder filled low-density band linear low-density polyethylene composites

机译：铜粉填充低密度带状线性低密度聚乙烯复合材料的热，机械和电性能

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摘要

Low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) with different copper contents were prepared by melt mixing. The copper powder particle distributions were found to be relatively uniform at both low and high copper contents. There was cluster formation of copper particles at higher Cu contents, as well as the formation of percolation paths of copper in the PE matrices. The DSC results show that Cu content has little influence on the melting temperatures of LDPE and LLDPE in these composites. From melting enthalpy results it seems as if copper particles act as nucleating agents, giving rise to increased crystallinities of the polyethylene. The thermal stability of the LDPE filled with Cu powder is better than that for the unfilled polymer. The LLDPE composites show better stability only at lower Cu contents. Generally, the composites show poorer mechanical properties (except Young's modulus) compared to the unfilled polymers. The thermal and electrical conductivities of the composites were higher than that of the pure polyethylene matrix for both the LDPE and LLDPE. From these results the percolation concentration was determined as 18.7 vol.% copper for both polymers. (c) 2005 Elsevier Ltd. All rights reserved.
机译：通过熔融混合制备了铜含量不同的低密度聚乙烯（LDPE）和线性低密度聚乙烯（LLDPE）。发现铜粉颗粒分布在低和高铜含量下都相对均匀。在较高的Cu含量下，存在铜粒子的簇状形成，以及在PE基体中铜的渗透路径的形成。 DSC结果表明，Cu含量对这些复合材料中LDPE和LLDPE的熔融温度影响很小。从熔融焓的结果看，似乎铜颗粒充当成核剂，从而增加了聚乙烯的结晶度。填充有铜粉的LDPE的热稳定性优于未填充的聚合物。 LLDPE复合材料仅在较低的Cu含量下显示出更好的稳定性。通常，与未填充的聚合物相比，复合材料的机械性能（杨氏模量除外）较差。对于LDPE和LLDPE，复合材料的热导率和电导率均高于纯聚乙烯基体。根据这些结果，两种聚合物的渗滤浓度被确定为铜的18.7体积％。 （c）2005 Elsevier Ltd.保留所有权利。

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