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首页> 外文期刊>Power Electronics, IET >Modular-based inductive power transfer system for high-power applications
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Modular-based inductive power transfer system for high-power applications

机译：用于大功率应用的基于模块的感应式电力传输系统

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摘要

Although the demand for high-power inductive power transfer (IPT) systems is on the rise, implementation of such IPT systems using low-cost semiconductor devices has been a challenge. This study presents a new IPT topology that facilitates easy integration of multiple IPT modules, which are made of low cost and freely available semiconductor components, to cater for high-power applications. An intermediate circuit, comprising an inductor??capacitor??inductor resonant network, serves as a contactless interface through which the modules of primary and secondary (pick-up) systems can be either series or parallel integrated. Inductor coils of the intermediate circuit and both primary and pick-up systems are magnetically coupled to allow for contactless power transfer. The proposed topology is parallel compensated to minimise its var requirement, and both the direction and amount of power flow are controlled by phase and/or magnitude modulation of voltages generated by primary and pick-up side converters. Theoretical analysis, together with simulations and experimental evidence of integrating four prototype bi-directional IPT systems to cater for 1.8 kW demand, is presented to show that the proposed new IPT topology is suitable for high-power applications, and flexible for both bi-directional and uni-directional contactless power transfer.
机译：尽管对大功率感应功率传输（IPT）系统的需求正在上升，但是使用低成本半导体器件实现这种IPT系统一直是一个挑战。这项研究提出了一种新的IPT拓扑结构，该拓扑结构有助于轻松集成多个由低成本和免费提供的半导体组件制成的IPT模块，以满足大功率应用的需求。包括电感器-电容器-电感器谐振网络的中间电路用作非接触式接口，通过该接口，初级和次级（拾取）系统的模块可以串联或并联集成。中间电路的电感线圈以及初级和拾取系统均磁耦合，以实现非接触式功率传输。拟议的拓扑经过并行补偿，以最大程度地减少其无功要求，并且功率流的方向和数量均由初级和拾取侧转换器生成的电压的相位和/或幅度调制控制。理论分析，以及结合四个原型双向IPT系统以满足1.8 kW需求的仿真和实验证据，表明所提出的新IPT拓扑既适用于大功率应用，又适用于双向应用单向非接触式功率传输。

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  • 来源
    《Power Electronics, IET》 |2012年第7期|p.1119-1126|共8页
  • 作者

    Madawala U.K.; Thrimawithana D.J.;

  • 作者单位

    Department of Electrical and Computer Engineering, The University of Auckland, Auckland, New Zealand;

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