...
首页> 外文期刊>精密工学会誌 >A relocation technique of surface asperity profiles for evaluating truncated surface (1st report) -Based on a collation index of two-dimensional profiles-
【24h】

A relocation technique of surface asperity profiles for evaluating truncated surface (1st report) -Based on a collation index of two-dimensional profiles-

机译:一种用于评估截断表面的表面粗糙轮廓的重定位技术(第一份报告)-基于二维轮廓的整理索引-

获取原文
获取原文并翻译 | 示例
           

摘要

Evaluation of truncated surface asperities is critically important in many industrial applications. It is necessary to compare original profile with truncated one in a discussion of truncation process, i.e., wear mechanism and plateau horning, etc. For the comparison of profiles, we have to relocate truncated profile to original one. But there is a limitation of relocation using a hardware. To relocate accurately, the authros suggest a relocation technique using software.
机译:在许多工业应用中,截短的表面凹凸不平的评估至关重要。在讨论截断过程时(即磨损机制和平稳变角等),有必要将原始轮廓与截断轮廓进行比较。为了比较轮廓,我们必须将截断轮廓重新定位到原始轮廓。但是使用硬件进行重定位存在局限性。为了准确地重定位,授权建议使用软件进行重定位。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号