Tin Whisker Revelations

KARL SEELIG

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Tin Whisker Revelations

机译：锡晶须启示

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The elusive tin whisker is only 1/100th the width of a human hair, but this tiny, single filament protrusion can wreak havoc with all sorts of electronics, and has even been cited as the cause of some sudden acceleration failures in cars. Tin whiskering is not a new phenomenon, however. It has been documented as far back as the 1940s, so why the heightened concern now? Lead was a great mitigator of whiskers and its removal from electronic solder opened the door for increased whisker proliferation, perhaps with sometimes deadly consequences.

机译：难以捉摸的锡晶须仅是人类头发宽度的1/100，但是这种细小的单丝突起会严重破坏各种电子设备，甚至被认为是汽车突然加速故障的原因。但是，锡晶须并不是一个新现象。它早在1940年代就被记录在案，那么为什么现在引起人们的更大关注？铅是缓解晶须的重要方法，从电子焊料中去除铅为晶须扩散的增加打开了大门，也许有时会造成致命的后果。

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《Printed Circuit Design & Manufacture》 |2014年第5期|71-72|共2页
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KARL SEELIG;
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1. The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter [J] . Li Yuancheng, Sun Menglong, Ren Siru, Materials Letters . 2020,第Jana1期

机译：氧化铜层不均匀对小直径SnAg微凸点锡晶须生长和锡晶须生长行为的影响
2. Separation of Lead with a Novel Ion Separating Agent Prepared by Clothing a Chitin Whisker on a Potassium Tetratitanate Whisker [J] . Juan Liu, Qin-guo Li, Wen-jing Xue Materials . 2017,第3期

机译：通过在甲钛酸钾晶须上穿甲壳素晶须制备的新型离子分离剂分离铅
3. Electroless plating copper coating of Al₁₈B₄O₃₃ whisker for interface improvement of whisker reinforced aluminium matrix composite [J] . Gao H.Q., Wang L.D., Fei W.D. Materials Science and Technology . 2007,第12期

机译：Al _{18 B _{4 O _{33 晶须的化学镀铜涂层，用于晶须增强铝基复合材料的界面改善}}}
4. STRATEGIC ENVIRONMENTAL RESEARCH AND DEVELOPMENT PROGRAM (SERDP) TIN WHISKER TESTING AND MODELING: TIN WHISKER GROWTH ON SAC305 ASSEMBLIES [C] . Stephan Meschter, Polina Snugovsky, Jeff Kennedy, SMTA international conference . 2014

机译：战略环境研究与开发计划（SERDP）锡晶须测试和建模：SAC305组件上的锡晶须生长
5. Metal Whiskers: The Role of Electric Fields in the Formation Mechanism and Methods for Whisker Growth Mitigation [D] . Borra, Venkata Shesha Vamsi. 2017

机译：金属晶须：电场在晶须生长缓解的形成机制和方法中的作用
6. Separation of Lead with a Novel Ion Separating Agent Prepared by Clothing a Chitin Whisker on a Potassium Tetratitanate Whisker [O] . Juan Liu, Qin-guo Li, Wen-jing Xue 2017

机译：用新型离子分离剂分离铅方法是将甲壳素晶须涂在四钛酸钾晶须上
7. Figure 6: Distribution of SNPs between chromosomes. (A) The average amount of SNPs per 1 MB per chromosome, distinguishing the varieties. The incut shows the dendrogram reflecting the total number of SNPs differentiating varieties. The colors show between which varieties the differences were considered (green is for S29↔YP, orange is for CS↔YP, blue is for S29↔CS). (B) The distribution of SNPs along the averaged chromosome. The boxes extend from the Q1 to Q3 quartile values of the data, with an orange line at the median (Q2). The whiskers extend from the edges of the box to show the range of the data. The position of the whiskers is set by 1.5 × IQR (IQR = Q3 − Q1) from the edges of the box. [O] . -1

机译：图6：染色体之间的SNP分布。（a）每条染色体每染色体每1mb的平均量，区分品种。 Imut显示了反映SNPS差异变化的总数的树枝图。颜色在哪些品种之间进行了考虑的差异（绿色是S29↔YP，橙色用于CS↔YP，蓝色为S29↔CS）。（b）沿着平均染色体的SNP分布。框从Q1到Q3四分位数的数据值，在中位数（Q2）处具有橙色线。晶须从框的边缘延伸以显示数据的范围。晶须的位置由从盒子的边缘设置为1.5×IQR（IQR = Q3-Q1）。

Tin Whisker Revelations

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