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DESIGN PRACTICES FOR PANELIZATION AND DEPANELIZATION

机译:电镀和去电镀的设计实践

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摘要

Panelization, also known as the processing of boards in an array format, keeps small boards attached to each other within a single, larger substrate. Panelization is used to process multiple small boards through assembly, and is becoming more prevalent as board sizes shrink. There are two primary reasons for using an array scheme: One is to increase throughput, and the other to permit the downstream manufacturing processes to maintain their standard panel sizes. Designing several smaller boards onto a standard 18 × 24" panel permits the fabricator and EMS to use common fixtures for efficient handling, printing, placement and reflow.
机译:拼板化,也称为阵列格式的板处理,可将小板彼此附着在一个较大的基板中。拼板用于通过组装来处理多个小板,并且随着板尺寸的缩小而变得越来越普遍。使用阵列方案的主要原因有两个:一个是增加产量,另一个是允许下游制造工艺保持其标准面板尺寸。在标准的18×24“面板上设计几个较小的板,使制造商和EMS可以使用通用的固定装置进行有效的处理,印刷,放置和回流。

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