Characteristics of a third-level pcb assembly

MUEED KHAN

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Characteristics of a third-level pcb assembly

机译：第三级PCB组件的特征

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By and large, PCB assembly up to now has been rather traditional. Surface mount technology has made significant inroads to account for the greater majority of assembly technology compared to through-hole. However, these days PCB assembly takes on new levels of technology, complexity and service requirements differently. At level one, OEMs require standard assemblies based on standard, defined processes and expect 100% yields, or close to them.

机译：总体而言，到目前为止，PCB组装一直是相当传统的。与通孔相比，表面贴装技术已取得重大进展，以占装配技术的绝大多数。然而，如今，PCB组装对技术，复杂性和服务要求的新要求有所不同。在第一级，OEM要求根据标准的，定义的过程进行标准组装，并期望100％的产率或接近它们。

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《Printed Circuit Design & Manufacture》 |2014年第7期|30-32|共3页
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MUEED KHAN;
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Characteristics of a third-level pcb assembly

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