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首页> 外文期刊>Proceedings of the Institution of Mechanical Engineers. Part L, Journal of Materials: Design and Application >Influence of Cu addition on transformation temperatures and thermal stability of TiNiPd high temperature shape memory alloys
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Influence of Cu addition on transformation temperatures and thermal stability of TiNiPd high temperature shape memory alloys

机译：Cu添加对变化温度的影响和Inipd高温形状记忆合金的热稳定性

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摘要

In this research, four high temperature shape memory alloys, Ti50Ni25-xPd25Cux (x = 0, 5, 10 and 15) were developed and designated 0Cu, 5 Cu, 10 Cu, and 15Cu, respectively. The effect of 5%, 10%, and 15% (all in atomic percent) Cu addition was investigated through their microstructure analysis, transformation temperatures and thermal stability. After the alloying of Cu content in their desired percentage, the alloys were named as 0Cu, 5Cu, 10Cu and 15Cu alloys. The martensite onset temperature M-s of ternary 0Cu alloy increased by 12.5 celcius, 27.5 celcius and 60.5 celcius, respectively, by replacement of Ni with 5%, 10% and 15% Cu. Similarly, the austenite finish temperature A(f) increased by 11 celcius, 25 celcius, and 52 celcius, respectively. At the same time, thermal hysteresis of the 5Cu, 10Cu, and 15Cu alloys decreased by 1.5 celcius, 2.5 celcius, and 8.5 celcius, respectively, as compared to 0Cu alloy. The thermal stability of ternary 0Cu alloy was improved by replacing Ni with Cu. During thermal cycling, the net drop in M-s and A(f) of 0Cu alloy was 7.5 celcius and 14 celcius, respectively. By replacing Ni with 5%, 10%, and 15% Cu, the net drop in M-s decreased to 5 celcius, 3.7 celcius, and 3 celcius, respectively, whereas the net drop in A(f) decreased to 10 celcius, 8.7 celcius, and 5 celcius. The overall results suggested that by the addition of 5%, 10%, and 15% Cu in place of Ni in TiNiPd alloys, the transformation temperatures and thermal stability improved. At the same time, thermal hysteresis decreased to a reasonable level which has a positive effect on the actuation behavior.
机译：在该研究中，分别开发了四个高温形状记忆合金Ti50Ni25-XPD25Cux（X = 0,5,10和15），分别分别表示0CU，5 Cu，10 Cu和15cu。通过其微观结构分析，转化温度和热稳定性研究5％，10％和15％（全部以原子百分比）的效果。在所需百分比的Cu含量合金化后，合金被命名为0Cu，5cu，10cu和15cu合金。三元0CU合金的马氏体发病温度M-S分别增加12.5个塞尔西乌斯，27.5塞尔西乌斯和60.5塞尔西乌斯，通过替换5％，10％和15％Cu的Ni。类似地，奥氏体精加工温度A（F）分别增加11个塞尔西乌斯，25个塞尔西乌斯和52个Celcius。同时，与0CU合金相比，5CU，10Cu和15Cu合金的热滞后分别降低1.5塞尔西乌斯，2.5塞尔西乌斯和8.5个细胞。通过用Cu代替Ni，改善了三元0CU合金的热稳定性。在热循环期间，0CU合金的M-S和（F）中的净下降分别为7.5塞尔西乌斯和14个细胞。通过用5％，10％和15％Cu的替换Ni，MS的净滴减少到5个塞尔西乌斯，3.7塞尔西乌斯和3个细胞，而（F）中的净下降减少到10个Celcius，8.7塞尔西乌斯和5个塞尔西乌斯。总体结果表明，通过加入5％，10％和15％Cu代替IniPd合金的Ni，转化温度和热稳定性提高。同时，热滞后降低到合理的水平，其对致动行为具有积极影响。

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