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首页> 外文期刊>Proceedings of the National Academy of Sciences of the United States of America >Changes in genomewide occupancy of core transcriptional regulators during heat stress
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Changes in genomewide occupancy of core transcriptional regulators during heat stress

机译：热应激期间核心转录调节子在全基因组中的占有率变化

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Organisms respond to heat stress by reprogramming gene expression. In Saccharomyces cerevisiae, heat-induced genes tend to be regulated by factors that belong to the Spt-Ada-Gcn5 acetyltransferase (SAGA) transcription regulatory pathway, whereas heat-repressed genes tend to be regulated by a parallel pathway involving transcription factor IID (TFIID). Here, we examine whether heat stress affects the occupancy of representative factors of each pathway at promoter regions throughout the yeast genome. Representatives of the SAGA pathway include the TATA binding protein, Spt3, and Mot1. Representatives of the TFIID pathway include the TATA binding protein, TAF1, and Bdf1. We find that heat stress causes disassembly of the TFIID pathway at genes that are inhibited by stress. In contrast, heat induces assembly of the SAGA pathway at stress-induced genes, although many also assemble along the TFIID pathway. Other genes were found to assemble almost exclusively along the TFIID pathway. Strikingly, these genes are lowly transcribed and are generally not induced. Thus, heat stress leads to factor assembly along each pathway but with distinct transcriptional outcomes. Further investigation of these pathways reveals that Bdf1 and Mot1 negatively regulate the SAGA pathway in different ways. The findings suggest that Bdf1 blocks assembly, whereas Mot1 promotes disassembly of the transcription machinery.
机译：生物通过重新编程基因表达来应对热应激。在酿酒酵母中，热诱导的基因倾向于受到属于Spt-Ada-Gcn5乙酰转移酶（SAGA）转录调控途径的因子的调控，而热抑制的基因倾向于受到涉及转录因子IID（TFIID）的平行途径的调控。 ）。在这里，我们检查热应激是否会影响整个酵母基因组启动子区域每个途径的代表性因子的占有率。 SAGA途径的代表包括TATA结合蛋白，Spt3和Mot1。 TFIID途径的代表包括TATA结合蛋白，TAF1和Bdf1。我们发现热应激会在受压力抑制的基因上引起TFIID途径的拆卸。相比之下，尽管许多人也沿着TFIID途径聚集，但热量会在应激诱导的基因处诱导SAGA途径的聚集。发现其他基因几乎仅沿着TFIID途径组装。令人惊讶的是，这些基因的转录程度很低，通常不会被诱导。因此，热应激导致沿着每个途径的因子装配，但是具有不同的转录结果。对这些途径的进一步研究表明，Bdf1和Mot1以不同的方式负调控SAGA途径。这些发现表明Bdf1阻止了装配，而Mot1促进了转录机制的拆卸。

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