New Materials Prompt New Reliability Issues

Tim Turner

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New Materials Prompt New Reliability Issues

机译：新材料提示新的可靠性问题

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Semiconductor device reliability can be divided into two types: infant mortality failures and wearout mechanisms. Infant mortality failures occur because of manufacturing defects. The sources of these defects are usually the same as those that cause yield loss, so instrumentation requirements for detecting both are similar.

机译：半导体器件的可靠性可以分为两种类型：婴儿死亡故障和磨损机制。婴儿死亡率的下降是由于制造缺陷造成的。这些缺陷的来源通常与导致良率损失的来源相同，因此检测这两种缺陷的仪器要求是相似的。

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《R & D》 |2000年第12期|p.27-29|共3页
作者
Tim Turner;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类 TB-045;
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New Materials Prompt New Reliability Issues

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