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首页> 外文期刊>Robotics and Computer Integrated Manufacturing >AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates
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AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates

机译：交流脉冲调制电液动力喷射印刷和化学镀铜，用于在柔性绝缘基板上进行导电微尺度图形化

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摘要

This paper presents a novel micro-manufacturing method for fabrication of electrical features and patterns on highly insulating substrates and flexible substrates based on high-resolution AC-pulse modulated electrohydrodynamic jet (e-jet) printing of silver nanoink as seed layer followed by electroless copper deposition. Traditional ink jet printing method is limited in printing resolution which is determined by dimension of printing nozzle and dimension of droplets. Traditional e-jet printing has the disadvantage of residual charge problem especially for highly insulating substrates which cannot dredge remained charge of printed droplets, resulting in distorted electrostatic field and low printing controllability. Meanwhile, for printing of liquid phase ink, feature resolution contradicts with the required thickness, which is a key factor of conductivity of printed patterns. In this paper, a novel AC-modulated e-jet printing technique is applied to neutralize charges on substrates by switching polarity of consequent droplets for direct printing of high-resolution conductive silver patterns on insulating substrates. Electroless copper deposition is introduced in the fabrication process to solve the thickness problem of the resulting features. Variables of fabrication process, including amplitude and frequency of AC-pulsed voltage, plotting speed, curing temperature, number of layers, concentration of solution for copper growth, were identified to achieve reliable and conductive printed patterns. Sub-20 μm silver tracks with resistivity about 3.16 times of bulk silver were successfully fabricated. We demonstrated that ac-pulse modulated e-jet printing followed by electroless copper deposition can produce high resolution conductive patterns with improved thickness on insulating substrates and flexible substrates, which can be applied to direct printing and micro scale patterning for flexible electronics and wearable devices applications.
机译：本文提出了一种新的微制造方法，该方法是在高分辨率绝缘的衬底和柔性衬底上制造电子特征和图案的新方法，该方法以银纳米墨水为种子层并随后化学镀铜的高分辨率交流脉冲调制电液流（e-jet）印刷为基础沉积。传统的喷墨打印方法的打印分辨率受到限制，该分辨率取决于打印喷嘴的尺寸和墨滴的尺寸。传统的电子喷墨打印具有残留电荷问题的缺点，特别是对于不能疏通打印液滴的残留电荷，导致静电场变形和打印控制性低的高度绝缘的基材。同时，对于液相油墨的印刷，特征分辨率与所需的厚度相矛盾，这是印刷图案的导电性的关键因素。在本文中，一种新颖的交流调制电子喷射印刷技术被应用于通过切换随之产生的液滴的极性来中和基板上的电荷，从而在绝缘基板上直接印刷高分辨率导电银图案。在制造过程中引入了化学镀铜以解决所得特征的厚度问题。确定制造工艺的变量，包括交流脉冲电压的幅度和频率，绘图速度，固化温度，层数，用于铜生长的溶液浓度，以实现可靠且导电的印刷图案。成功地制造了电阻率为电阻率约为银体积的3.16倍的亚20μm银轨迹。我们证明了交流调制电子喷射印刷后再进行化学镀铜可以在绝缘基板和柔性基板上产生具有改进厚度的高分辨率导电图案，可将其应用于柔性电子产品和可穿戴设备应用的直接印刷和微型图案化。

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