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Increasing the Cooling Efficiency of Power Semiconductor Devices

机译：提高功率半导体器件的冷却效率

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摘要

The task of developing a refined procedure for the determining thermal resistance coefficient of a power semiconductor device (PSD)-cooler contact allowing for roughness of contacting surfaces was set. For this purpose, mathematical modeling methods applying the theory of random functions and full-scale test methods of elements of semiconductor converters were used. Using the developed software and experimental dependences, the compressive forces and roughness of surfaces at which the maximum intensity of the contact heat transfer in power units with the evaporative-air cooling is attained are determined. It is shown that the number of contact spots and actual contact area increase with an increase in pressure thereby lowering the thermal resistance. The lower the surface roughness is, the lower the values of pressure are at which the maximum intensity of the contact heat exchange can be attained. Considerable lowering in the contact thermal resistance for each contact pair occurs for a definite pressure only, after which further increase in the load (larger than 20-30 mPa) does not yield the desirable effect of the contact thermal resistance and losses the sense thereof. The application of KPT-8 heat-conducting paste and K-1 adhesive lowers the contact by more than three times. The application of tin and iridium spacers for the PSD-cooler pair with nickel-plated surfaces has given no positive result. Based on the calculated and experimental data, the requirements for degree of treatment of contact surfaces using nickel coatings, heat-conducting pastes, and spacers that allow increasing in PSD cooling efficiency by 10-14% are refined.
机译：设定了开发精细过程的任务，该过程用于确定功率半导体器件（PSD）-冷却器触点的热阻系数，从而允许接触表面的粗糙度。为此，使用了应用随机函数理论的数学建模方法和半导体转换器元件的全面测试方法。使用开发的软件和实验相关性，确定表面的压缩力和粗糙度，在这些压力和粗糙度下，在达到蒸发空气冷却的功率单元中接触传热的最大强度。可以看出，接触点的数量和实际接触面积随着压力的增加而增加，从而降低了热阻。表面粗糙度越低，可以达到接触热交换的最大强度的压力值越低。仅对于确定的压力，每个触头对的触头热阻就会显着降低，此后负载的进一步增加（大于20-30 mPa）不会产生理想的触头热阻效果，并且失去其感官。 KPT-8导热膏和K-1粘合剂的应用将接触降低了三倍以上。在具有镀镍表面的PSD冷却器对中使用锡和铱隔离层并没有取得积极的结果。根据计算和实验数据，对使用镍涂层，导热膏和垫片的接触表面处理程度的要求进行了细化，这些要求可使PSD的冷却效率提高10-14％。

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