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首页> 外文期刊>Science and Technology of Advanced Materials >Aging behavior of ultrafine grained Al-2 wt%Cu alloy severely deformed by accumulative roll bonding
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Aging behavior of ultrafine grained Al-2 wt%Cu alloy severely deformed by accumulative roll bonding

机译：累积辊压粘结严重变形的Al-2 wt％Cu超细晶粒合金的时效行为

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摘要

Aging behavior of an ultrafine grained Al-Cu alloy was studied. Al-2 wt%Cu alloy sheets were solution-treated at 550℃ for 1.8 ks and then severely deformed up to an equivalent strain of 4.8 by the accumulative roll bonding (ARB) process at ambient temperature. The ARB processed material showed the ultrafine lamellar boundary structure with mean boundary interval of 67 nm. The ARB processed sheets and the starting sheets having conventionally coarse grains were aged at 190℃. The coarse grained specimen for comparison showed typical aging behavior showing in-grain precipitation of the thin-plate shaped θ′ phase coherent to {001} crystallographic plane of the matrix aluminum. Hardness of the coarse grained specimen increased as precipitation proceeds, reached the maximum around HV60, and decreased owing to over-aging. On the other hand, the ARB processed sample with the ultrafine-grained structure showed very high hardness of HV115 in the as-deformed state, and the hardness decreased monotonously with increasing the aging time. The detailed microstructural observations clarified that recovery and grain growth of the matrix proceeds during 190℃ aging and the precipitation only at grain boundaries occurs in the ultrafine grained material. Instead of the θ′ phase, the equilibrium θ phase preferentially appeared in the ultrafine grained specimen. The coarsening of the matrix was mainly responsible for monotonous decrease of hardness. The kinetics of precipitation in the ARB processed sample was much faster than that of the coarse grained materials. It was concluded that the aging behaviors in severely deformed material having the ultrafine grained structure are completely different from the conventional ones in the coarse-grained materials.
机译：研究了超细晶粒Al-Cu合金的时效行为。将Al-2 wt％Cu合金板在550℃下固溶处理1.8 ks，然后在环境温度下通过累积辊压结合（ARB）工艺将其严重变形至4.8的等效应变。经ARB处理的材料显示出超细的层状边界结构，平均边界间隔为67 nm。将经过ARB处理的片材和具有常规粗晶粒的起始片材在190℃时效。用于比较的粗粒样品显示出典型的时效行为，表明与基体铝的{001}晶面相干的薄板形θ'相在晶内析出。粗粒试样的硬度随着降水的进行而增加，在HV60附近达到最大值，并由于过时效而降低。另一方面，经过ARB处理的具有超细晶粒结构的样品在变形后的状态下显示出非常高的HV115硬度，并且硬度随着时效时间的增加而单调降低。详细的显微组织观察表明，在190℃时效过程中，基体的恢复和晶粒长大继续进行，并且仅在晶界出现沉淀。代替θ′相，平衡θ相优先出现在超细颗粒试样中。基体的粗化主要是造成硬度单调下降的原因。 ARB处理过的样品中的沉淀动力学要比粗粒材料快得多。结论是，具有超细晶粒结构的严重变形材料的时效行为与粗粒材料中的常规行为完全不同。

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