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首页> 外文期刊>SEI Technical Review >Wafer Bonding of Polycrystalline Spinel with LINbO_3/LiTaO_3 for Temperature Compensation of RF Surface Acoustic Wave Devices
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Wafer Bonding of Polycrystalline Spinel with LINbO_3/LiTaO_3 for Temperature Compensation of RF Surface Acoustic Wave Devices

机译：LINbO_3 / LiTaO_3与多晶硅尖晶石的晶片键合以补偿RF表面声波器件的温度

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摘要

This paper proposes use of polycrystalline spinel for the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO_3 (LT) and LiNbO_3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance, including the temperature coefficient of frequency (TCF), was measured. For comparison, SAW resonators employing Si and sapphire in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than other materials.
机译：本文提出了将多晶尖晶石用于射频（RF）表面声波（SAW）器件的温度补偿。可以使用粘合剂和直接粘合技术将尖晶石与LiTaO_3（LT）和LiNbO_3（LN）晶片粘合。在LT（LN）/尖晶石结构上制造了一系列RF SAW谐振器，并测量了它们的性能，包括频率温度系数（TCF）。为了进行比较，还制造了使用Si和蓝宝石代替尖晶石的SAW谐振器。结果表明，多晶尖晶石比其他材料具有更好的TCF改善效果。

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