Development of Via Connection Technology with Conductive Paste

Yoshio OKA; Takashi KASUGA; Hiroshi TOMIOKA; Sumito UEHARA; Jin Joo PARK; Naota UENISHI; Yasuhiro OKUDA

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Development of Via Connection Technology with Conductive Paste

机译：带有导电胶的通孔连接技术的发展

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Flexible printed circuit (FPC) boards need to have fine pitch patterns for lighter, thinner, and smaller electronic equipment, and connection technology for metal layers (other than copper) is required for FPC diversification. Conductive paste via connection technology offers advantages for manufacturing fine pitch FPC boards and can be applied to non-copper metal layers. The authors have developed highly reliable via connecting technology using conductive paste containing silver nano particles.

机译：柔性印刷电路板（FPC）板需要具有更细的间距图案，以用于更轻，更薄和更小的电子设备，并且FPC多样化需要金属层（铜以外的）连接技术。通过连接技术的导电胶为制造细间距FPC板提供了优势，并且可以应用于非铜金属层。作者已经使用包含银纳米粒子的导电胶开发了高度可靠的通孔连接技术。

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来源
《SEI Technical Review》 |2012年第75期|106-109|共4页
作者
Yoshio OKA; Takashi KASUGA; Hiroshi TOMIOKA; Sumito UEHARA; Jin Joo PARK; Naota UENISHI; Yasuhiro OKUDA;
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作者单位

Electronics & Material R&D Laboratories;

Electronics & Material R&D Laboratories;

Sumitomo Electric Printed Circuits, Inc.;

Sumitomo Electric Printed Circuits, Inc.;

Sumitomo Electric Printed Circuits, Inc.;

Development Department, Sumitomo Electric Printed Circuits, Inc.;

Electronics & Material R&D Laboratories;

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原文格式 PDF
正文语种 eng
中图分类
关键词
FPC; conductive paste; nano particle; via connecting;

机译：FPC;导电胶纳米粒子通过连接;

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1. Development of Via Connection Technology with Conductive Paste [J] . Yoshio OKA, Takashi KASUGA, Hiroshi TOMIOKA, SEI Technical Review . 2012,第74期

机译：带有导电胶的通孔连接技术的发展
2. Thin and High-Density Circuit 'Conductive Paste Connection FPC' [J] . SEI Technical Review . 2014,第78期

机译：薄而高密度的电路“导电膏连接FPC”
3. FPCs with Conductive Paste Connection Slims Circuit Boards [J] . Asia electronics industry . 2013,第8期

机译：带有导电膏连接的FPC细长型电路板
4. The development of Anisotropic Conductive Paste (ACP) to make solder metal connection [C] . Kawamoto S., Matsumura K., Abe Y. Electronic Components and Technology Conference . 2008

机译：各向异性导电浆料（ACP）的发展制造焊料金属连接
5. Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections [D] . Choquette, Stephanie Michele. 2018

机译：液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
6. Development of a Conductive Polymer Based Novel 1-DOF Tactile Sensor with Cylindrical Arch Spring Structure Using 3D Printing Technology [O] . Peshan Sampath, Eranga De Silva, Lakshitha Sameera, 2019

机译：基于3D打印技术的基于导电聚合物的新型1自由度具有圆柱拱形弹簧结构的触觉传感器的开发
7. Development of a Curable Conductive Copper Paste in Air [O] . Masashi Kajita, Tomoyuki Takahashi, Akemi Kano, 2015

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Development of Via Connection Technology with Conductive Paste

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