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Development of Low Cost Millimeter Wave MMIC

机译：低成本毫米波MMIC的开发

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摘要

This paper describes the cost effective 77 GHz transmitter and receiver MMIC (monolithic microwave integrated circuit) that uses a three-dimensional MMIC technology optimized for flip-chip implementation. The MMIC structure incorporates inverse TFMS lines so that a ground metal can be applied to cover the whole chip surface except for interconnect pads. Four metal layers, each of them are covered with polyimide and SiN films. Hence, these MMIC chips require no package, and can be directly assembled on a printed circuit board. The transmitter MMIC is composed of an x8 multiplier chain (9.5 GHz/38 GHz MLT, 38 GHz AMP, and 38 GHz/76 GHz MLT), and a driver + power amplifier. A saturated output power of 14 dBm has been obtained between 76 and 77 GHz from this transmitter MMIC. A portion of the 38 GHz amplifier output is split for the receiver mixer. The receiver MMIC is composed of multi LNA + MIX blocks and a common x2 multiplier block that provides a 10 dBm of local oscillator power. A receiver gain of 10 dB and a noise figure of 7.8 dB for a baseband frequency at 10 MHz have been obtained. The die size of the transmitter is 1.5 mm x 2.0 mm and the chip area of the receiver is 1.9 mm x 1.3 mm. 【keyworks】3D-MMIC;WLCSP;automotive radar;transmitter;receiver
机译：本文介绍了具有成本效益的77 GHz发送器和接收器MMIC（单片微波集成电路），它使用针对倒装芯片实现进行了优化的三维MMIC技术。 MMIC结构包含反向TFMS线，因此可以使用接地金属覆盖互连焊盘以外的整个芯片表面。四个金属层，每个金属层均覆盖有聚酰亚胺和SiN膜。因此，这些MMIC芯片不需要封装，并且可以直接组装在印刷电路板上。发送器MMIC由x8乘法器链（9.5 GHz / 38 GHz MLT，38 GHz AMP和38 GHz / 76 GHz MLT）和驱动器+功率放大器组成。从该发射器MMIC获得了76至77 GHz之间的14 dBm饱和输出功率。 38 GHz放大器输出的一部分被分配给接收器混频器。接收器MMIC由多个LNA + MIX模块和一个提供10 dBm本振功率的公共x2乘法器模块组成。对于10 MHz的基带频率，已获得10 dB的接收机增益和7.8 dB的噪声系数。发射器的芯片尺寸为1.5毫米x 2.0毫米，接收器的芯片面积为1.9毫米x 1.3毫米。 【主要工作】3D-MMIC; WLCSP;汽车雷达;发射机;接收机

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  • 来源
    《SEI Technical Review》 |2011年第72期|p.70-74|共5页
  • 作者

    Koji TSUKASHIMA; Miki KUBOTA; Osamu BABA; Hideki TANGO; Atsushi YONAMINE; Tsuneo TOKUMITSU; Yuichi HASEGAWA;

  • 作者单位

    Advanced Circuit Design R&D Depart-ment, Transmission Device R&D Labora-tories;

    Manager, Advanced Circuit Design R&D Department,Transmission Device R&D Laboratories;

    Assistant Manager, Advanced Circuit Design R&D De-partment, Transmission Device R&D Laboratories;

    Assistant Manager, Radio Transmission Systems Depart-ment, Information & Communications Laboratories;

    Advanced Circuit Design R&D Department, Transmis-sion Device R&D Laboratories;

    Ph.D.IEEE Fellow Chief Engineer, Transmission Device R&D Laboratories;

    Sumitomo Electric Device Innovations, Inc;

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