首页> 外文期刊>Sensing and imaging >Enhanced Performance of Spiral Co‑planar Inter‑Digital Capacitive Structures for Sensing Applications
【24h】

Enhanced Performance of Spiral Co‑planar Inter‑Digital Capacitive Structures for Sensing Applications

机译:增强螺旋共平面数字电容结构对传感应用的性能

获取原文
获取原文并翻译 | 示例
           

摘要

In this work we consider a Spiral Inter-Digital Capacitive (SIDC) structure for its optimum design and performance analysis based on finite element simulation, for possible application as sensors. The effects of relevant geometrical parameters like sensor electrode width, inter-electrode gap, number of electrode pairs and electrode height on sensor output capacitance are evaluated and analyzed. In addition, influence of a test sample over the designed sensor for varying lift-off distances from the top of the sensor surface and for various material permittivity values are investigated. Results of the studies show that a spiral structure has about 25% higher sensitivity for its capacitance value compared to a corresponding Rectangular Inter-Digital Capacitive (RIDC) structure of comparable dimensions. The simulation results have been verified experimentally by fabricating and testing SIDC and RIDC structures for dielectric characterization of materials and proximity measurement applications. The results point to the possibility of designing and fabricating spiral interdigital capacitive sensors with higher sensitivity for a multitude of applications.
机译:在这项工作中,我们考虑了一种基于有限元模拟的最佳设计和性能分析的螺旋间数字电容(SIDC)结构,可以应用于传感器。评估和分析相关几何参数等传感器电极宽度,电极宽度,电极对相数和电极高度的电极对的影响。另外,研究了测试样品在设计传感器上的影响,用于从传感器表面的顶部和各种材料介电常数值改变升空距离。研究结果表明,与可比较尺寸的相应矩形的矩形互联电容(RIDC)结构相比,螺旋结构对其电容值的敏感性高约25%。通过制造和测试SIDC和RIDC结构来实验验证模拟结果,用于材料和接近测量应用的介电表征。结果指出了设计和制造螺旋渐斜电容式传感器的可能性,对多种应用具有更高的灵敏度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号