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首页> 外文期刊>IEEE sensors journal >Nondestructive Testing for Multi-Layer Metal-Metal Bonded Structure by Using Inductive Lock-In Thermograhy
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Nondestructive Testing for Multi-Layer Metal-Metal Bonded Structure by Using Inductive Lock-In Thermograhy

机译：感应锁定热电分析法对多层金属-金属粘结结构进行无损检测

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摘要

Multilayer materials with metal-metal bonded structure have been widely applied in aviation, aerospace and nuclear industrial fields. The presence of inner defects such as debonding, air gaps leads to significant degradation of the load capacity and mechanical behaviors. Due to their complex structure, debonding detection in metal-metal structure inherently remains challenge. This paper proposes a feasibility study of non-destructive inspection of debonding defect in lead-steel sample by using inductive lock-in thermography (ILT). The detectability validation is carried out based on experimental studies. Theoretical analysis, excitation source and system design as well as various influence parameters of ILT are discussed and optimized. Fourier-transform based post-processing has been investigated to analyze both magnitude and phase images for defects identification. The obtained results have been promising validated and it indicated the ability to improve the signal-to-noise ratio. The comparative experiment using different methods (ILT, ECPT, and OLT) has been carried out. The results have revealed that the ILT has advantages and could be served as a strong candidate for practical adoption in debonding defect inspection in metal-metal bonded sample.
机译：具有金属-金属结合结构的多层材料已广泛应用于航空，航天和核工业领域。内部缺陷（例如脱胶，气隙）的存在会导致负载能力和机械性能的显着下降。由于其复杂的结构，金属-金属结构中的脱胶检测固有地仍然是挑战。本文提出了一种利用感应锁定热成像技术（ILT）对铅-钢样品中脱胶缺陷进行无损检测的可行性研究。可检测性验证是基于实验研究进行的。讨论并优化了ILT的理论分析，激励源和系统设计以及各种影响参数。已经对基于傅立叶变换的后处理进行了研究，以分析幅度图像和相位图像以进行缺陷识别。获得的结果已经被有希望的验证，并且表明了改善信噪比的能力。已经进行了使用不同方法（ILT，ECPT和OLT）的对比实验。结果表明，ILT具有优势，可以作为在金属-金属键合样品中进行脱键缺陷检查的实际应用的有力候选。

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  • 来源
    《IEEE sensors journal》 |2017年第20期|6716-6723|共8页
  • 作者

    Yuyu Zhu; Bin Gao; Gui Yun Tian; Wai Lok Woo; Guangping Tang; Chaoming Sun; Jianwen Li;

  • 作者单位

    University of Electronic Science and Technology of China, Chengdu, China;

    School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China;

    University of Newcastle, Newcastle, U.K.;

    University of Newcastle, Newcastle, U.K.;

    China Academy of Engineer Physics, Mianyang, China;

    China Academy of Engineering Physics, Institute of Machinery Manufacturing Technology, Mianyang, China;

    China Academy of Engineering Physics, Institute of Machinery Manufacturing Technology, Mianyang, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Heating systems; Lead; Eddy currents; Sensors; Bonding; Skin; Conductivity;

    机译：加热系统;铅;涡流;传感器;键合;皮肤;电导率;

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