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首页> 外文期刊>IEEE Journal of Solid-State Circuits >A Column-Row-Parallel ASIC Architecture for 3-D Portable Medical Ultrasonic Imaging
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A Column-Row-Parallel ASIC Architecture for 3-D Portable Medical Ultrasonic Imaging

机译：用于3D便携式医学超声成像的列行并行ASIC架构

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摘要

This paper presents a scalable column-row-parallel ASIC architecture for 3-D portable medical ultrasound. Through its programmable row-by-row or column-by-column operations for both transmit and receive beam-formation, linear scaling in interconnection, data acquisition complexity, power dissipation, and programming time is achieved. In addition, its per-element controllers can activate fine granularity aperture definition when more functionality is favored over the linear-scaling power and speed efficiency. This front-end architecture is backward compatible to implement existing widely used array aperture patterns, while supporting new imaging apertures and algorithms. It lends itself very well for the combination with integrated or external digital beamforming circuits. A proof-of-concept ASIC is fabricated and flip-chip bonded to a capacitive micromachined ultrasonic transducer (CMUT). Each three-level pulsing transmitter (Tx) is 46% more power efficient than a traditional two-level version, with high-voltage (HV) multiplexers (MUXs) designed for flexible Tx parallelization. Each low-noise receiver (Rx) consumes 1.4 mW active power and sleep power, with optimized source follower stages to combine analog outputs for improved SNR. The transceivers are also fault-tolerant to inevitable defects in transducers, greatly enhancing assembly yield. The system demonstrates 3-D plane-wave generation to implement the coherent compounding algorithm for fast volume rate (62.5 volume/s), high-quality 3-D ultrasonic imaging. An interleaved checker board pattern with and excitations is also demonstrated for ultrasonic harmonic imaging, which reduces transmitted second harmonic distortion (HD2) by over 20 dB.
机译：本文提出了一种用于3D便携式医学超声的可扩展列行并行ASIC架构。通过其用于发送和接收波束形成的可编程逐行或逐列操作，可以实现互连的线性缩放，数据采集复杂性，功耗和编程时间。此外，当更多的功能优于线性缩放能力和速度效率时，其按元素的控制器可以激活细粒度的孔径定义。该前端体系结构向后兼容，以实现现有的广泛使用的阵列孔径图案，同时支持新的成像孔径和算法。它非常适合与集成或外部数字波束形成电路组合使用。制作了概念验证ASIC，并将其倒装芯片连接到电容式微机械超声换能器（CMUT）。每个三级脉冲发射器（Tx）的功率效率比传统的两级脉冲发射器高46％，而高压（HV）多路复用器（MUX）设计用于灵活的Tx并行化。每个低噪声接收器（Rx）都消耗1.4 mW的有功功率和睡眠功率，并具有优化的源极跟随器级来合并模拟输出以改善SNR。收发器还可以容忍传感器中不可避免的缺陷，从而大大提高了组装良率。该系统演示了3-D平面波生成，以实现相干复合算法以实现快速体积率（62.5 vol / s），高质量3-D超声成像。还演示了带有和激励的交错棋盘图案，用于超声谐波成像，可将传输的二次谐波失真（HD2）降低20 dB以上。

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