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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Low-Power 16 x 10 Gb/s Bi-Directional Single Chip CMOS Optical Transceivers Operating at ≪ 5 mW/Gb/s/link
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Low-Power 16 x 10 Gb/s Bi-Directional Single Chip CMOS Optical Transceivers Operating at ≪ 5 mW/Gb/s/link

机译：低功耗16 x 10 Gb / s双向单芯片CMOS光学收发器，工作在≪ 5 mW / Gb / s / link

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摘要

We report here on a parallel optical transceiver based on a single 0.13 mum CMOS amplifier chip with 16 transmitter and 16 receiver channels. The transceiver is designed to support very low-power, chip-to-chip optical data buses on printed circuit boards at data rates up to 10 Gb/s/channel. Optical interfaces to the chip are provided by 16-channel photodiode (PD) and VCSEL arrays directly flip-chip soldered to the CMOS IC. The resulting complete transceivers, or optochips, are low-cost, low-profile highly-integrated chip-scale components. The packaging approach, dense hybrid-integration of optical devices with CMOS, facilitates further scaling to even larger 2-D arrays for future massively parallel optical data buses. Comparison with a previously reported high-speed transceiver Optochip is provided to provide insight into the design space of dense CMOS-based parallel optical transceivers.
机译：我们在这里报告一个基于单个0.13微米CMOS放大器芯片的并行光收发器，该芯片具有16个发送器和16个接收器通道。该收发器设计为以高达10 Gb / s /通道的数据速率支持印刷电路板上的超低功耗芯片间光学数据总线。直接通过倒装芯片焊接到CMOS IC的16通道光电二极管（PD）和VCSEL阵列提供了与芯片的光学接口。最终的完整收发器或光芯片是低成本，小巧的高度集成芯片级组件。封装方法是光学器件与CMOS的密集混合集成，有助于进一步扩展到更大的2-D阵列，以用于将来的大规模并行光学数据总线。与以前报道的高速收发器Optochip进行比较，以提供对基于CMOS的密集并行光收发器设计空间的了解。

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