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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Stacked-Chip Implementation of On-Chip Buck Converter for Distributed Power Supply System in SiPs
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Stacked-Chip Implementation of On-Chip Buck Converter for Distributed Power Supply System in SiPs

机译：SiP中分布式电源系统的片上降压转换器的堆叠芯片实现

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摘要

An on-chip buck converter which is implemented by stacking chips and suitable for on-chip distributed power supply systems is proposed. The operation of the converter with 3-D chip stacking is experimentally verified for the first time. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70 mA and a voltage conversion ratio of 0.7 with a switching frequency of 200 MHz and a 2 $times$ 2 mm on-chip LC output filter. The active part and the passive LC output filter are implemented on separate chips fabricated in 0.35- $mu{hbox {m}}$ CMOS and connected with metal bumps. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3% is also discussed.
机译：提出了一种通过堆叠芯片实现并适用于片上分布式电源系统的片上降压转换器。具有3D芯片堆叠的转换器的操作首次通过实验验证。所制造的转换器在70 mA的输出电流和0.7的电压转换比，200 MHz的开关频率和2 x 2 mm的片上LC输出滤波器的情况下实现62％的最大功率效率。有源部件和无源LC输出滤波器在以0.35- CMOS CMOS制成并与金属凸块相连的单独芯片上实现。还讨论了使用玻璃环氧中介层将最大功率效率提高到71.3％。

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