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首页> 外文期刊>IEEE Journal of Solid-State Circuits >An ultrahigh-density high-speed loadless four-transistor SRAM macrowith twisted bitline architecture and triple-well shield
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An ultrahigh-density high-speed loadless four-transistor SRAM macrowith twisted bitline architecture and triple-well shield

机译:具有扭曲位线架构和三阱屏蔽的超高密度高速无负载四晶体管SRAM宏

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摘要

We have developed two schemes for improving access speed andnreliability of a loadless four-transistor (LL4T) SRAM cell: andual-layered twisted bitline scheme, which reduces coupling capacitancenbetween adjacent bitlines in order to achieve highspeed READ/WRITEnoperations, and a triple-well shield, which protects the memory cellnfrom substrate noise and alpha particles. We incorporated these schemesnin a high-performance 0.18-Μm-generation CMOS technology andnfabricated a 16-Mb SRAM macro with a 2.18-Μm2 memory cell.nThe macro size of the LL4T-SRAM is 56 mm2, which is 30% ton40% smaller than a conventional six-transistor SRAM when compared withnthe same access speed. The developed macro functions at 500 MHz and hasnan access time of 2.0 ns. The standby current has been reduced to 25nΜA/Mb with a low-leakage nMOSFET in the memory cell
机译:我们开发了两种方案来提高无负载四晶体管(LL4T)SRAM单元的访问速度和可靠性:双层扭曲位线方案,该方案降低了相邻位线之间的耦合电容,从而实现了高速READ / WRITE操作,并采用了三阱屏蔽,可保护存储单元免受基板噪声和alpha颗粒的影响。我们将这些方案整合到了高性能的0.18μm代CMOS技术中,并制造了一个具有2.18μm2存储器单元的16Mb SRAM宏.n LL4T-SRAM的宏大小为56 mm2,比30%ton小40%。与相同的访问速度相比,传统的六晶体管SRAM。所开发的宏功能在500 MHz下运行,访问时间为2.0 ns。借助存储单元中的低泄漏nMOSFET,待机电流已降至25nΜA/ Mb

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