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首页> 外文期刊>Solid-State Electronics >Si tunneling transistors with high on-currents and slopes of 50 mV/dec using segregation doped NiSi_2 tunnel junctions
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Si tunneling transistors with high on-currents and slopes of 50 mV/dec using segregation doped NiSi_2 tunnel junctions

机译:使用隔离掺杂的NiSi_2隧道结,具有高导通电流和50 mV / dec斜率的Si隧道晶体管

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摘要

Planar and nanowire (NW) tunneling field effect transistors (TFETs) have been fabricated on ultra thin strained and unstrained SOI with shallow doped nickel disilicide (NiSi_2) source and drain (S/D) contacts. We developed a novel, self-aligned process to form the p-i-n TFETs which greatly simplifies their fabrication by tilted dopant implantation using the high-k/metal gate as a shadow mask and dopant segregation. Two methods of dopant segregation are compared: dopant segregation based on the "snow-plough" effect of dopants during silicidation and implantation into the silicide (IIS) followed by thermal outdiffu-sion. High drive currents of up to 60 μA/um of planar p-TFETs were achieved indicating good silicide/sil-icon tunneling junctions. The non-linear temperature dependence of the inverse subthreshold slope S indicates characteristic TFET behavior. Strained Si NW array n-TFETs with omega shaped HfO_2/TiN gates show high drive currents of 7 μA/μm @ 1 V V_(dd) and steep inverse subthreshold slopes with minimum values of <50 mV/dec due to the smaller band gap of strained Si and optimized electrostatics.
机译:平面和纳米线(NW)隧穿场效应晶体管(TFET)已在具有薄掺杂二硅化镍(NiSi_2)源极和漏极(S / D)触点的超薄应变和非应变SOI上制造。我们开发了一种新颖的自对准工艺来形成p-i-n TFET,通过使用高k /金属栅作为荫罩和掺杂剂隔离的倾斜掺杂剂注入大大简化了它们的制造。比较了两种掺杂剂偏析方法:基于硅化物在硅化过程中的“雪effect”效应和注入到硅化物(IIS)中,然后进行热扩散的掺杂​​剂偏析。实现了高达60μA/ um的平面p-TFET的高驱动电流,表明良好的硅化物/硅图标隧穿结。反亚阈值斜率S的非线性温度依赖性表示特征TFET行为。具有Ω型HfO_2 / TiN栅极的应变Si NW阵列n-TFET在1 V V_(dd)时显示出7μA/μm的高驱动电流,并且由于带隙较小,反向亚阈值斜率极小,最小值<50 mV / dec应变硅和优化的静电。

著录项

  • 来源
    《Solid-State Electronics》 |2013年第6期|211-215|共5页
  • 作者单位

    Peter Gruenberg Institut 9 (PGI-9/IT), JARA-FIT, Forschungszentrum Juelich, 52425Juelich, Germany;

    Peter Gruenberg Institut 9 (PGI-9/IT), JARA-FIT, Forschungszentrum Juelich, 52425Juelich, Germany;

    Peter Gruenberg Institut 9 (PGI-9/IT), JARA-FIT, Forschungszentrum Juelich, 52425Juelich, Germany;

    Peter Gruenberg Institut 9 (PGI-9/IT), JARA-FIT, Forschungszentrum Juelich, 52425Juelich, Germany;

    Peter Gruenberg Institut 9 (PGI-9/IT), JARA-FIT, Forschungszentrum Juelich, 52425Juelich, Germany;

    SOITEC, Pare Technologique des Fontaines, 38190 Bernin, France;

    Peter Gruenberg Institut 9 (PGI-9/IT), JARA-FIT, Forschungszentrum Juelich, 52425Juelich, Germany;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Dopant-segregation; Tilted implantation; Nanowire TFET; Nickel silicide;

    机译:掺杂物分离;倾斜植入纳米线TFET;硅化镍;

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