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Influence of preparation parameters for low-energy ion beam nitridation of Ⅲ-Ⅴ semiconductor surfaces

机译:制备参数对Ⅲ-Ⅴ族半导体表面低能离子束氮化的影响

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摘要

The nitridation of InAs, InP, and InSb by low-energy N_2~+ ion bombardment at different preparation parameters was studied by near-edge X-ray absorption fine structure, photoemission spectroscopy (PES), and resonant PES measurements. The investigated surface nitride layers mainly consist of compounds with In-N, V-N bonds and interstitial nitrogen (N_i). The final remaining nitride layer composition strongly depends on the chosen preparation parameters. The nitridation affect composition and annealing temperature offers several opportunities to affect defect curing by ordering and removing oxinitrides, N-O bonds and N_i from nitrided surfaces.
机译:通过近缘X射线吸收精细结构,光电子能谱(PES)和共振PES测量,研究了低能N_2〜+离子轰击在不同制备参数下对InAs,InP和InSb的氮化作用。研究的表面氮化物层主要由具有In-N,V-N键和间隙氮(N_i)的化合物组成。最终剩余的氮化物层组成在很大程度上取决于所选的制备参数。氮化影响成分和退火温度通过有序化和从氮化表面去除氧氮化物,N-O键和N_i提供了几种影响缺陷固化的机会。

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