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Compatibility of perovskite contact layers between cathode and metallic interconnector plates of SOFCs

机译：阴极和SOFC的金属互连板之间的钙钛矿接触层的兼容性

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From the viewpoint of corrosion resistance alumina and chromia forming alloys are potential candidate materials for SOFC interconnector plates. However, at the SOFC operating temperatures of around 950℃ the first-mentioned alloy type tends to form electrically insulating oxide scale at the interfaces between the interconnector and the ceramic contact layer, the interface oxide consisting of Al_2O_3 and M_2O_(3±x)-nAl_2O_3. Chromium-based oxide dispersion strengthened (ODS) alloys are more suitable for SOFC applications because the chromia-based scale forming at the interfaces with the contact layers has much higher electronic conductivity than the alumina-based scale. However, upon high-temperature exposure, the composition of the ceramic contact layers is significantly changed due to solid state and vapour phase chromium transport from the alloy into the contact layer. Coatings might be necessary to prevent this degradation mechanism.
机译：从耐蚀性的角度来看，氧化铝和氧化铬形成合金是用于SOFC互连板的潜在候选材料。然而，在SOFC的工作温度约为950℃时，首先提到的合金类型趋于在互连器和陶瓷接触层之间的界面处形成电绝缘氧化物垢，该界面氧化物由Al_2O_3和M_2O_（3±x）-组成。 nAl_2O_3。铬基氧化物弥散强化（ODS）合金更适合SOFC应用，因为在与接触层的界面处形成的基于氧化铬的氧化皮比基于氧化铝的氧化皮具有更高的电导率。但是，在高温下，由于固态和气相铬从合金向接触层的迁移，陶瓷接触层的组成发生了显着变化。可能需要涂层以防止这种降解机理。

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