Wire bonding is increasingly moving to copper instead of gold because of the relative cost of these materials. The migration has begun in earnest in logic and will soon be followed by MEMS and analog applications. But while copper avoids some of the drawbacks of gold, including its rapidly escalating cost, it comes with its own challenges and is considerably less mature. High-density pad imprint sampling is necessary to achieve the high reliability the packaging industry needs, which thankfully can approach that of gold. This need is well met by the 3D optical microscope.
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