3.5D interposers: pcb replacement?

Phil Garrou

首页> 外文期刊>Solid state technology >3.5D interposers: pcb replacement?

【24h】

3.5D interposers: pcb replacement?

机译：3.5D插入器：PCB更换？

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

The most controversial comment came from TSMC's Doug Yu, senior director of front-end and back-end technology development, who challenged the current nomenclature and pronounced that the versatile inter-poser technology should be called "3.5D" instead of 2.5D, since it is and will be capable of much more than the simple 3D packaging stack. Yu's presentation was title "Semiconductor Paradigm Shift and Increased Foundry Roles." The term 2.5D is usually credited to ASE's Dr. Ho Ming Tong who, around 2009 (or even earlier), declared that we might need an intermediate step towards 3D packaging, since the infrastructure and standards were not yet ready.

机译：最具争议的评论来自台积电的前端和后端技术开发高级总监Doug Yu，他对当前的命名法提出了挑战，并宣布多功能中介者技术应称为“ 3.5D”而不是2.5D，因为它具有并且将比简单的3D包装堆栈具有更多的功能。于的演讲题目是“半导体范式转变与代工角色的增加”。 2.5D一词通常要归功于ASE的何明棠博士，他在2009年左右（甚至更早）宣布，由于基础设施和标准尚未准备就绪，我们可能需要朝3D封装迈出中间一步。

著录项

来源
《Solid state technology》 |2012年第5期|p.11|共1页
作者
Phil Garrou;
展开▼
作者单位

展开▼
收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications [J] . Kumar V., Sharma R., Uzunlar E., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2014,第8期

机译：气隙互连：针对背板，PCB和插入器应用的建模，优化和基准测试
2. Total Knee Replacement for Rheumatoid Arthritis by Using Improved Cement Technique by Interposing Hydroxyapatite Granules [J] . Sok Chol Kim, Hironobu Oonishi, Hiroyuki Oonishi, Key Engineering Materials . 2008,第Pt2期

机译：通过使用羟基磷灰石颗粒改良水泥技术替代类风湿关节炎的全膝关节
3. Hydroxyapatite granules interposed at bone-cement interface in total hip replacements: histological study of retrieved specimens. [J] . Oonishi H, Kadoya Y, Iwaki H, Journal of biomedical materials research. Part B, Applied biomaterials. . 2000,第2期

机译：在全髋关节置换物中插入骨水泥界面的羟基磷灰石颗粒：取回标本的组织学研究。
4. Interposer test: Testing PCBs that have shrunk 100x [C] . Mak TM IEEE International Test Conference . 2014

机译：中介层测试：测试收缩100倍的PCB
5. Aerobic bacterial degradation of hydroxylated PCBs: Potential implications for natural attenuation of PCBs. [D] . Afsarmanesh Tehrani, Rouzbeh. 2013

机译：羟化多氯联苯的好氧细菌降解：多氯联苯自然衰减的潜在影响。
6. Assessment of a decontamination process for dioxins and PCBs from fish meal by replacement of fish oil [O] . EFSA Panel on Contaminants in the Food Chain (CONTAM), Helle Katrine Knutsen, Jan Alexander, 2018

机译：通过替代鱼油评估鱼粉中二恶英和多氯联苯的去污工艺
7. Assessment of a decontamination process for dioxins and PCBs from fish meal by replacement of fish oil [O] . Helle Katrine Knutsen, Jan Alexander, Lars Barregård, 2018

机译：通过替代鱼油评估二恶英和PCB的去污过程
8. Technique for Successful Replacement of the Esophagus with an Interposed Susbternal Colon Segment [R] . Graeber, G. M., Grishkin, B. A., Cohen, D. J., 1983

机译：成功置换食管的技术与插入的胸部结肠段

3.5D interposers: pcb replacement?

摘要

著录项

相似文献

相关主题

期刊订阅