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Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni-W alloy films

机译:电沉积纳米晶Ni-W合金薄膜的纳米压痕和微机械断裂韧性

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摘要

The fracture toughness values for Ni-W alloy were calculated, assuming a linear elastic behaviour, from the fracture loads of the cantilever beams using the following equations: K_k=(6PL)/(bh~2)·(πa)~(1/2).F(a/h) F(a/h) =1.12-1.39(a/h) +7.32(a/h)~2-13.1(a/h)~3+14.0(a/h)~4 where, P is the load at fracture, L is the distance between the notch and the point of application of load, b is the beam width, h is the beam height, a is the depth of the notch, and F(a/h) is given in [24]. The length, I, was determined from an image saved whilst positioning the tip in the nanoindenter. The width, b, was measured from the SEM image taken before testing. Notch depth, a, was measured from SEM images taken after testing. The distribution of fracture toughness values thus obtained is shown in Table 3 and lies within the range of 1.49-5.14 Mpam~(1/2).
机译:假设线性弹性行为,从悬臂梁的断裂载荷计算镍-钨合金的断裂韧性值,公式如下:K_k =(6PL)/(bh〜2)·(πa)〜(1 / 2).F(a / h)F(a / h)= 1.12-1.39(a / h)+7.32(a / h)〜2-13.1(a / h)〜3 + 14.0(a / h)〜在图4中,P是断裂时的载荷,L是缺口与载荷施加点之间的距离,b是梁的宽度,h是梁的高度,a是缺口的深度,F(a / h)在[24]中给出。长度I是根据将尖端放置在纳米压头中时保存的图像确定的。宽度b是根据测试前拍摄的SEM图像测得的。从测试后拍摄的SEM图像测量切口深度a。如此获得的断裂韧性值的分布示于表3中,并且在1.49-5.14Mpam〜(1/2)的范围内。

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