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Modification of composite hardness models to incorporate indentation size effects in thin films

机译:修改复合硬度模型以将压痕尺寸效应纳入薄膜

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摘要

The indentation hardness of copper films of thickness 25 to 1400 nm on oxidized silicon substrates is determined by nanoindentation. The load-displacement curves are analysed using the Oliver and Pharr method. An indentation size effect is observed at low relative indentation depths for the copper films. Composite hardness models are applied to the data without an indentation size effect and the Korsunksy and Puchi-Cabrera models are found to give very good fits to this data. The Nix and Gao mechanism based strain gradient plasticity (MSG) model is used to account for the indentation size effect. An attempt is made to modify the existing composite hardness models using the MSG model to incorporate indentation size effect. By modification of both the Korsunsky and Puchi-Cabrera models a good fit to the entire range of data is obtained.
机译:通过纳米压痕确定氧化硅衬底上厚度为25至1400 nm的铜膜的压痕硬度。使用Oliver和Pharr方法分析了载荷-位移曲线。在低相对压痕深度下观察到铜膜的压痕尺寸效应。在没有压痕尺寸影响的情况下,将复合硬度模型应用于数据,并且发现Korsunksy和Puchi-Cabrera模型非常适合该数据。基于Nix和Gao机制的应变梯度可塑性(MSG)模型用于解释压痕尺寸效应。尝试使用MSG模型修改现有的复合硬度模型,以合并压痕尺寸效应。通过修改Korsunsky模型和Puchi-Cabrera模型,可以很好地拟合整个数据范围。

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