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Factors influencing adhesion of fluorocarbon (FC) thin film on silicon substrate

机译：影响碳氟化合物（FC）薄膜在硅基板上的附着力的因素

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摘要

Hydrophobic polymeric thin films (e.g., fluorocarbon) are used in micro-fluidic applications for drag reduction. However, one of the major issues hindering their usage is reliability. Previous work shows a degradation/delamination of fluorocarbon (FC) film over a period of time. This paper investigates various processing parameters influencing the adhesion of hydrophobic FC coating to a silicon substrate. The FC film is processed using the "Bosch" process (alternating etching and deposition steps) to perform deep anisotropic silicon etching. The Si(100) wafers are first etched to a depth of about 5-10 μm and then coated with CF_x film from the C_4F_8 monomer. The effect of pressure, inductively coupled plasma power, thickness of the film, and the gas ratio of mixing H_2 to C_4F_8 has been investigated using a fractional factorial experimental design. By better understanding the effect of each input variable, the reliability of the deposited film can be improved and this is discussed in detail in this paper.
机译：疏水聚合物薄膜（例如，碳氟化合物）用于微流体应用中以减少阻力。但是，阻碍其使用的主要问题之一是可靠性。先前的工作显示了碳氟化合物（FC）膜在一段时间内的降解/分层。本文研究了影响疏水性FC涂层与硅基底粘附的各种工艺参数。使用“ Bosch”工艺（交替的蚀刻和沉积步骤）对FC膜进行处理，以执行深各向异性硅蚀刻。首先将Si（100）晶片蚀刻到约5-10μm的深度，然后用C_4F_8单体的CF_x膜进行涂覆。使用分数阶乘实验设计研究了压力，感应耦合等离子体功率，薄膜厚度以及混合H_2与C_4F_8的气体比例的影响。通过更好地理解每个输入变量的影响，可以提高沉积膜的可靠性，本文将对此进行详细讨论。

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