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首页> 外文期刊>日本機械学会論文集. B編 >Optical Measurement of Thermal Diffusivity of Wafer-Like Thin Solid Sample in The Direction of The Thickness Using Laser AC Heating and Reflectance Thermometry
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Optical Measurement of Thermal Diffusivity of Wafer-Like Thin Solid Sample in The Direction of The Thickness Using Laser AC Heating and Reflectance Thermometry

机译：激光交流加热和反射测温仪在厚度方向上对类似晶片的薄固体样品的热扩散率进行光学测量

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摘要

This paper presents a non-contact AC optical technique for measuring the thermal diffusivity of a wafer-like thin solid sample. The technique is based on heating one solid surface with a odulated laser beam and monitoring the corresponding temperature modulation of the other surface across the sample using the reflectance of a probe beam. The phase lag between the two laser signals is independent of the optical properties of the sample as well as the laser intensities, and can be related to the thermal diffusivity. A detailed theoretical analysis is presented to estimate the thermal diffusivity of the solid from the phase lag measured as a function of the modulation frequency. A closed form solution in the high-frequency limit is derived in order to provide a simple estimation procedure. The effect of misalignment of the two lasers is studied and conditions for making robust measurements are suggested. As a benchmark of this technique, the thermal conductivity of a single crystal si1icon sample was measured to within 2 percent of reported values.
机译：本文提出了一种非接触式交流光学技术，用于测量晶片状薄固体样品的热扩散率。该技术的基础是，用经调制的激光束加热一个固体表面，并使用探测光束的反射率监视整个样品表面另一表面的相应温度调制。两个激光信号之间的相位滞后与样品的光学特性以及激光强度无关，并且可能与热扩散率有关。提出了详细的理论分析，以根据测量的相位滞后估算固体的热扩散率，该相位滞后是调制频率的函数。为了提供简单的估计程序，导出了高频极限的封闭形式的解。研究了两个激光器未对准的影响，并提出了进行稳健测量的条件。作为该技术的基准，单晶硅样品的热导率测量值在报告值的2％以内。

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