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A new maximal diagnosis algorithm for interconnect test

机译:一种新的互连测试最大诊断算法

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摘要

Interconnect test for highly integrated environments becomes more important in terms of its test time and a complete diagnosis, as the complexity of the circuit increases. Since the board-level interconnect test is based on boundary scan technology, it takes a long test time to apply test vectors serially through a long scan chain. Complete diagnosis is another important issue. Since the board-level test is performed for repair, noticing the faulty position is an essential element of any interconnect test. Generally, the interconnect test algorithms that need a short test time cannot perform the complete diagnosis and the algorithms that perform the complete diagnosis need a lengthy test time. To overcome this problem, a new interconnect test algorithm is developed. The new algorithm can provide the complete diagnosis of all faults with a shorter test time compared to the previous algorithms.
机译:随着电路复杂度的提高,针对高度集成环境的互连测试就其测试时间和全面的诊断而言变得更加重要。由于板级互连测试基于边界扫描技术,因此通过较长的扫描链串行应用测试向量需要花费较长的测试时间。完全诊断是另一个重要问题。由于执行的是板级测试以进行维修,因此注意位置错误是任何互连测试的基本要素。通常,需要短测试时间的互连测试算法无法执行完整的诊断,而执行完整诊断的算法则需要较长的测试时间。为了克服这个问题,开发了一种新的互连测试算法。与以前的算法相比,该新算法可以以更短的测试时间提供所有故障的完整诊断。

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