CEVA Announces Availability of Silicon Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems

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CEVA Announces Availability of Silicon Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems

机译：CEVA宣布推出基于硅的CEVA-XC软件开发套件，用于快速设计多模式，软件定义的调制解调器

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CEVA, Inc., a licensor of silicon intellectual property (SIP) platform solutions and DSP cores, announced the availability of a new silicon-based, software development kit (SDK) for runtime software development based on the CEVA-XC323 DSP architecture. The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance.

机译：硅知识产权（SIP）平台解决方案和DSP内核的许可方CEVA，Inc.宣布推出新的基于硅的软件开发套件（SDK），用于基于CEVA-XC323 DSP架构的运行时软件开发。嵌入在SDK中的CEVA-XC323芯片由CEVA设计，并采用65nm工艺制造，可提供高达800MHz的性能。

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《Wi-Fi - WLAN》 |2012年第1期|p.4-5|共2页
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CEVA Announces Availability of Silicon Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems

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