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Investigation of Crosstalk and Coupling Effects of Incident Plane Waves in Orthogonal Microstrips in High-Speed Integrated Circuits Using Full-Wave and Quasi-Static Methods

机译:使用全波和准静态方法研究高速集成电路中正交微带中入射平面波的串扰和耦合效应

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摘要

The crosstalk and coupling of the external fields on orthogonal microstrip transmission lines in different layers have significant effects on signal quality in MMIC and PCBs. In this paper the crosstalk is analyzed in detail using both full-wave and quasi-static methods. The used full wave method is mixed potential integral equation method of moment (MPIEMoM). Because of the weak coupling between lines, the effect of the incident plane-wave is studied by applying transmission line theory in a scattered voltage formulation uses quasi-TEM propagation model for each interconnection and the exact distribution of the incident electric field within the layers. Afterward, by using the predetermined lumped circuit model of the cross-region, the effect of coupling between two lines is calculated and then applied to terminal voltages in 1–20 GHz frequency range which results in the final terminal voltages. Keywords Orthogonal microstrips - Incident field - Crosstalk - High-speed MMICs
机译:在不同层的正交微带传输线上,外部场的串扰和耦合会对MMIC和PCB中的信号质量产生重大影响。本文使用全波和准静态方法对串扰进行了详细分析。使用的全波法是矩的混合势积分方程法(MPIEMoM)。由于线之间的耦合较弱,因此通过在离散电压公式中应用传输线理论对入射光的影响进行研究,其中对于每个互连以及各层中入射电场的精确分布,均使用准TEM传播模型。然后,通过使用预定的跨区域集总电路模型,计算两条线之间的耦合效应,然后将其施加到1–20 GHz频率范围内的端子电压,从而得到最终的端子电压。正交微带-入射场-串扰-高速MMIC

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