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Effect of soldering method on tensile strength of gold-palladium ceramic alloy.

机译:焊接方法对金钯陶瓷合金拉伸强度的影响。

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摘要

The present study was designed to compare the tensile strength obtained by microwave post-ceramic soldering, conventional post-ceramic soldering, and laser post-ceramic welding. Specific aims were to compare tensile strength (measured by Instron Universal testing machine) and study representative fracture surfaces (observed with the help of SEM sections).;The research hypothesis was the tensile strength of microwave post-ceramic soldering is comparable or superior to that of conventional post-ceramic soldering, and the laser post ceramic welding.;Gold - Palladium ceramic alloy (Evolution lite, Ivoclar-Vivadent. Inc) and gold based solder were used in this study. Twenty seven wax samples were cast in Au-Pd alloy and randomly divided into four groups as follows: (1) laser welding with a specific post filler alloy (Laser ceramic white .5mm wire, Ivoclar-Vivadent Inc), (2) microwave soldering with a post ceramic solder (.585 Fine gold solder, Ivoclar Vivadent Inc.), (3) conventional soldering (Programat P200, Ivoclar vivadent Inc.) with the same post-ceramic solder used in the microwave soldering group, (4) control. All specimens were heat treated to simulate normal porcelain sintering sequence (IPS d.SIGN, Ivoclar Vivadent Inc.). The tensile strength of the four groups was measured by an Instron Universal Testing Machine. Results were analyzed statistically using one way analysis of variance (ANOVA). The surface and fracture sites of specimens were randomly selected and subjectively evaluated for fracture type and porosities using scanning electron microscope.;A significant difference in tensile strength was found among all four groups. The control group showed the highest tensile strength, followed by the microwave, conventional, and laser welding group. The microwave and conventional (furnace) solder joints presented varying degrees of porosity and a combination of ductile and brittle fractures. Control specimens showed a homogeneous ductile fracture with no contamination or inclusions. However, the laser-weld samples showed large voids at the middle of the joint surface that were surrounded with ductile fracture pattern.;Higher tensile strength was found for gold-palladium alloys soldered using microwave soldering than for either conventional soldering or laser welding. Conventional soldering resulted in higher tensile strength than laser welding. Pending a clinical validation of these results, it appears that, under the experimental conditions described, either microwave or conventional post-ceramic soldering satisfies ordinary clinical requirements related to tensile strength.
机译:本研究旨在比较通过微波后陶瓷焊接,常规后陶瓷焊接和激光后陶瓷焊接获得的拉伸强度。具体目的是比较拉伸强度(用Instron Universal试验机测量)和研究代表性的断口表面(借助SEM截面观察)。研究假设是微波后陶瓷焊接的拉伸强度与之相当或优于该值。常规的后陶瓷焊接和激光后陶瓷焊接。;本研究中使用了金-钯陶瓷合金(Evolution lite,Ivoclar-Vivadent。Inc)和金基焊料。将27个蜡样品铸成Au-Pd合金,并随机分为以下四组:(1)使用特定的后填充合金(激光陶瓷白色.5mm焊丝,Ivoclar-Vivadent Inc)进行激光焊接,(2)微波焊接用陶瓷后焊剂(.585纯金焊料,Ivoclar Vivadent Inc.),(3)常规焊接(Programat P200,Ivoclar vivadent Inc.)与微波焊接组中使用的相同陶瓷后焊剂(4)控制。对所有样品进行热处理,以模拟正常的陶瓷烧结顺序(IPS d.SIGN,Ivoclar Vivadent Inc.)。通过Instron通用测试机测量四组的拉伸强度。使用一种方差分析(ANOVA)对结果进行统计分析。随机选择试样的表面和断裂部位,并使用扫描电子显微镜对断裂类型和孔隙率进行主观评估。在所有四个组中,抗拉强度均存在显着差异。对照组表现出最高的拉伸强度,其次是微波,常规和激光焊接组。微波和常规(熔炉)焊点的孔隙率不同,并且韧性和脆性断裂结合在一起。对照标本显示均匀的韧性断裂,没有污染或夹杂物。然而,激光焊接的样品在接头表面的中部显示出大的空隙,并被延展性的断裂图案所包围。使用微波焊接的金-钯合金的拉伸强度高于传统的焊接或激光焊接。常规焊接比激光焊接具有更高的拉伸强度。在对这些结果进行临床验证之前,似乎在所述的实验条件下,微波或传统的陶瓷后焊接都可以满足与拉伸强度有关的普通临床要求。

著录项

  • 作者

    Ghadhanfari, Husain.;

  • 作者单位

    State University of New York at Buffalo.;

  • 授予单位 State University of New York at Buffalo.;
  • 学科 Health Sciences Dentistry.;Engineering Materials Science.
  • 学位 M.S.
  • 年度 2009
  • 页码 41 p.
  • 总页数 41
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 口腔科学;工程材料学;
  • 关键词

  • 入库时间 2022-08-17 11:37:35

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