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Assembly Process and Reliability Evaluation for High Density Step Assembly

机译：高密度阶梯装配的装配过程和可靠性评估

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摘要

The past four decades have witnessed significant developments in the electronics packaging industry. The need for lower cost and advanced functionality in terms of faster speed, higher density, packed in a smaller form factor have been the key driving factors of this evolution. Even though advances in chip technology are promising, the market demand rate has always been higher. Moreover, achieving required scalability without affecting reliability and cost are some of the major challenges that manufacturers have always faced. While the electronics packaging industry is trying to overcome the reliability and yield related challenges for the transition towards 3D integration, alternative board level stacking techniques are proving useful for satisfying the customer demands of higher density, faster speeds and reduced form factor in the case of memory systems. This has led to significant developments in stacking technologies which are serving as an alternate way to satisfy market demands.;Module level stacking technologies, using flexible as well as rigid substrates, have been proven to be successful for increasing density without significantly increasing the real estate. Similarly, for over a decade, device level stacking approaches, such as Package-on-Package (PoP), have been proven to be useful in a large number of instances. However, both these stacking technologies have concerns related to reliability, yield or manufacturing flexibility at the board level manufacturers end. Therefore, an alternative device stacking methodology, which is completely compatible with the generic SMT process, is proposed in this research.;A new technology, named the High Density STEP module, is being developed to satisfy above mentioned market needs. Since the devices and the interposers are arranged in a STEP formation to increase the module's density, this assembly has been named as the High Density STEP module. The T-shaped PCB interposer and the research associated with the development of the SMT processes in order to create a manufacturable and reliable product are unique factors of this research.;A High Density STEP module increases the memory density compared to a standard module by placing a T-shaped interposer in the available space between adjacent memory devices, without affecting the standard form factor. The complex structure and the assembly process might pose a variety of challenges related to the assembly process, performance and the reliability of the end product. Therefore, the primary objectives of this research focus on developing a defect free assembly process, enhancing the thermal performance by establishing cooling guidelines and evaluation of the solder joint reliability of the STEP module. This type of device stacking approach is relatively new and has not been thoroughly researched. Therefore, there is a need to conduct systematic research that can help to standardize the manufacturing processes with an aim to achieve a reliable product which is the primary goal of this research endeavor.;The research methodology involved an in-depth study of the assembly process with a primary focus on the T-shaped interposer assembly. Good print definition was achieved by determining the printing parameters required for the solder bumping process. This was validated by comparing the experimental results of the solder paste volume with the values obtained from a theoretical model. Component placement guidelines were established by recommending a preferred sequence for placing the components in order to avoid defects and material wastage. Finally, the reflow profile recipe was designed in addition to evaluating different SMT fixture designs in order to reduce warpage in the interposer PCB. Interposer PCB warpage that was within the acceptable limits was achieved by using a particular reflow profile recipe and SMT fixture design. Moreover, recommendations were made to change the interposer PCB panel structure to make the PCB less prone to warpage.;The second part of the research methodology focused on the thermal performance characterization of the STEP assembly. Initially, a baseline performance was evaluated for a single module placed in a server environment with an airflow of 1 m/s. The results were validated with a simulation model developed in FloTHERMRTM. It was shown that the maximum case temperature remains well below the maximum rated case temperature for all BGA devices present on the module. The simulation model was extended further to study four modules placed in parallel, 10 mm apart. The airflow was varied from 0 m/s to 4 m/s. The results showed that a minimum of 1 m/s airflow is necessary to retain good thermal performance. (Abstract shortened by ProQuest.).
机译：在过去的四十年中，电子包装行业取得了长足发展。在更快的速度，更高的密度，更小的外形尺寸方面对低成本和先进功能的需求一直是这一发展的关键驱动因素。尽管芯片技术的发展是有希望的，但市场需求率一直很高。此外，在不影响可靠性和成本的情况下实现所需的可伸缩性是制造商始终面临的一些主要挑战。在电子封装行业试图克服向3D集成过渡的可靠性和良率相关挑战的同时，替代的板级堆叠技术已证明对满足客户在内存情况下更高密度，更快速度和减小尺寸的需求很有用系统。这导致了堆叠技术的重大发展，这些技术可替代满足市场需求的方法。事实证明，使用柔性和刚性基板的模块级堆叠技术在增加密度而又不显着增加房地产的情况下是成功的。 。类似地，十多年来，已证明设备级堆叠方法（例如，层叠封装（PoP））在大量实例中很有用。但是，这两种堆叠技术都与板级制造商的可靠性，成品率或制造灵活性有关。因此，本研究提出了一种与通用SMT工艺完全兼容的替代器件堆叠方法。；正在开发一种新技术，称为高密度STEP模块，以满足上述市场需求。由于设备和中介层以STEP形式排列以增加模块的密度，因此该组件已被命名为High Density STEP模块。 T形PCB中介层以及与SMT工艺开发相关的研究，以制造出可制造且可靠的产品，是这项研究的独特因素。高密度STEP模块与标准模块相比，通过放置可提高存储密度在相邻存储设备之间的可用空间中放置一个T形插入物，而不会影响标准尺寸。复杂的结构和组装过程可能会带来与组装过程，最终产品的性能和可靠性有关的各种挑战。因此，本研究的主要目标集中在开发无缺陷的组装工艺，通过建立冷却准则和评估STEP模块的焊点可靠性来提高热性能。这种类型的设备堆叠方法相对较新，尚未进行深入研究。因此，有必要进行系统的研究，以有助于使制造过程标准化，以期获得可靠的产品，这是该研究工作的主要目标。研究方法涉及对组装过程的深入研究。主要关注T形中介层组件。通过确定焊料凸点工艺所需的打印参数，可以实现良好的打印清晰度。通过将焊膏体积的实验结果与从理论模型获得的值进行比较，可以验证这一点。通过推荐放置组件的最佳顺序来建立组件放置准则，以避免缺陷和材料浪费。最后，除了评估不同的SMT夹具设计之外，还设计了回流曲线配方，以减少插入式PCB的翘曲。通过使用特定的回流曲线配方和SMT夹具设计，可以实现在可接受范围内的内插器PCB翘曲。此外，还提出了一些建议，以更改插入式PCB面板的结构，以使PCB较少翘曲。研究方法的第二部分侧重于STEP组件的热性能表征。最初，评估了放置在服务器环境中气流为1 m / s的单个模块的基准性能。使用在FloTHERMRTM中开发的仿真模型验证了结果。结果表明，模块上所有BGA器件的最高外壳温度仍远低于最高额定外壳温度。仿真模型进一步扩展，以研究四个间隔10 mm并排放置的模块。气流从0 m / s变为4 m / s。结果表明，保持良好的热性能至少需要1 m / s的气流。 （摘要由ProQuest缩短。）。

著录项

  • 作者

    Phadke, Gaurav Hemant.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Mechanical engineering.
  • 学位 Ph.D.
  • 年度 2018
  • 页码 196 p.
  • 总页数 196
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

  • 入库时间 2022-08-17 11:53:00

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