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首页> 外文期刊>The journal of physical chemistry, C. Nanomaterials and interfaces >Thermal Stability of Tungsten Oxide Clusters
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Thermal Stability of Tungsten Oxide Clusters

机译：氧化钨团簇的热稳定性

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Thermal reduction of tungsten oxide nanoclusters supported on thin silicon and aluminum oxide films and ranging in size from 2 to 8 nm was studied by in situ X-ray photoelectron spectroscopy. We observed that with a decrease in size oxide clusters demonstrate enhanced resistance to the oxide reduction when heated in vacuum. The effect is presumed to be related to the point defects that serve as nucleation sites in the oxide reduction process. It is suggested that due to the increased Laplace pressure small clusters contain lower defect density thus making them less susceptible to the thermal reduction. Preamorphization of the oxide particles by low-energy ion bombardment demonstrated a lowering of oxide decomposition temperature thus supporting the inference on the defect stimulated oxide reduction. These results provide a novel model system to understand the reduction behavior of bulk tungsten oxides and might be of crucial relevance for applications where the use of clusters is of special importance.
机译：通过原位X射线光电子能谱研究了负载在硅和氧化铝薄膜上的氧化钨纳米簇的热还原，其尺寸为2至8 nm。我们观察到，随着尺寸的减小，氧化物簇在真空中加热时表现出增强的抗氧化物还原性。推测该效果与在氧化物还原过程中用作成核位点的点缺陷有关。建议由于拉普拉斯压力的增加，小簇含有较低的缺陷密度，因此使其不易受到热还原的影响。通过低能离子轰击对氧化物颗粒进行预非晶化处理，表明氧化物分解温度降低，从而支持了缺陷促进氧化物还原的推断。这些结果提供了一种新颖的模型系统，以了解块状氧化钨的还原行为，并且对于使用团簇特别重要的应用可能具有至关重要的意义。

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