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Improved Metal-Adhesive Polymers from Copper(I)-Catalyzed Azide-Alkyne Cycloaddition

机译:铜(I)催化的叠氮化物-炔烃环加成反应的改进的金属粘合聚合物

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摘要

Electrically conductive adhesive polymers offer many potential advantages relative to Sn-Pb solders, including reduced toxicity, low cost, low processing temperatures, and the ability to make application-specific formulations. Polymers generated from the copper(I)-catalyzed cycloaddition (CuAAC) reaction between multivalent azides and alkynes have previously been identified as strong metal-binding adhesives. Herein we demonstrate that the performance of these materials can be remarkably improved by the incorporation of a flexibility-inducing difunctionalized component and a tertiary amine additive in optimized concentrations. The best formulations were identified by means of rapid adhesion testing of a library of potential candidates by using a custom-built instrument and validated in an American Society for Testing and Materials (ASTM)-standard lap-shear test. Characteristic phase transitions were identified by differential scanning calorimetry (DSC) for adhesives with and without the additives as a function of curing temperature. The incorporation of flexible components was found to more than double the strength of the adhesive. Moreover, the adhesive was made electrically conductive by the inclusion of 20 wt% silver-coated copper flakes and further improved in this regard by the incorporation of multiwalled carbon nanotubes in the formulation.
机译:相对于Sn-Pb焊料,导电胶粘剂聚合物具有许多潜在的优势,包括降低毒性,降低成本,降低加工温度以及制造专用配方的能力。由多价叠氮化物和炔烃之间的铜(I)催化的环加成(CuAAC)反应生成的聚合物先前已被确定为具有强固性的金属粘合剂。在本文中,我们证明了通过以最佳浓度掺入可诱导挠性的双官能化组分和叔胺添加剂,可以显着改善这些材料的性能。最佳配方是通过使用定制仪器对潜在候选物库进行快速粘合测试而确定的,并在美国材料试验学会(ASTM)的标准搭接剪切试验中得到了验证。通过差示扫描量热法(DSC)确定具有和不具有添加剂的粘合剂的特征相变与固化温度的关系。发现掺入柔性组分使粘合剂的强度增加一倍以上。此外,通过包含20重量%的银涂覆的铜薄片使粘合剂导电,并且在这方面通过在配方中引入多壁碳纳米管进一步改进了粘合剂。

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